Senior / Staff Dry Etch Process Development Engineer

Intel Corporation•Rio Rancho, NM

9d•$155,520 - $255,200•Onsite

About The Position

As a Module Development Engineer, you will lead the design, development, and optimization of manufacturing processes and equipment solutions that enable Intel’s device architectures. The role involves feasibility studies, process integration, and collaboration with cross-functional teams to ensure process readiness and scalability for high-volume manufacturing. Contributions support Intel’s technology roadmap while optimizing production efficiency, product performance, and quality. Intel’s Manufacturing and Operations organization develops manufacturing processes and solutions to support semiconductor innovation and evolving industry demands. The team collaborates across global groups to advance technology and manufacturing capabilities.

Requirements

PhD in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or a related STEM field, plus at least 5 years of semiconductor Dry Etch/Plasma Etch process development experience; or a master’s degree in a listed or related STEM field plus at least 7 years of that experience; or a bachelor’s degree in a listed or related STEM field plus at least 10 years of that experience.
At least 2 years of experience applying Design of Experiments (DOE) and Statistical Process Control (SPC) methodologies in semiconductor process development and optimization.
At least 2 years of experience leading cross-functional semiconductor process development projects, collaborating across engineering disciplines and driving technical solutions to meet project and manufacturing objectives.

Nice To Haves

Experience with advanced Dry Etch/Plasma Etch technologies, including Through-Silicon Via (TSV) processes.
Experience in semiconductor foundry or advanced technology development environments.
Experience with process automation systems and advanced process control methodologies.
Experience collaborating with semiconductor equipment suppliers on process optimization, development, and implementation.
Experience driving process improvements involving yield, defect reduction, process stability, and manufacturing performance.
Experience leading technical work groups applying model-based problem solving (MBPS) to complex dry etch problems.
Demonstrated technical leadership in complex semiconductor process development initiatives involving multiple engineering teams.

Responsibilities

Lead development and implementation of manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
Perform process integration and provide solutions that meet device specifications for high-volume manufacturing and future technologies.
Conduct research and pathfinding to enable manufacturing of innovative device architectures and ensure scalability for high-volume production.
Develop technology process roadmaps and strategies aligned with Intel’s goals and cost considerations.
Collaborate with equipment and materials suppliers to advance processes and enhance production outputs.
Conduct feasibility studies using theoretical simulations and practical engineering methods to evaluate process technology capabilities.
Recommend and implement manufacturing process and equipment modifications to improve efficiency, reliability, and yield.
Monitor industry trends and technical advancements to drive innovation and maintain Intel’s competitive position.