About The Position

As a Module Development Engineer, you will lead the design, development, and optimization of manufacturing processes and equipment solutions that enable Intel’s device architectures. The work includes feasibility studies, process integration, and collaboration with cross-functional teams to ensure process readiness and scalability for high-volume manufacturing. The role contributes to Intel’s technology roadmap while supporting production efficiency, product performance, and quality. The position is part of Intel’s Manufacturing and Operations organization, which develops manufacturing processes and solutions for semiconductor innovation. The role is based on-site in Albuquerque, New Mexico.

Requirements

  • PhD in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or a related STEM field, and at least 5 years of semiconductor Dry Etch/Plasma Etch process development experience; OR a master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, and at least 7 years of such experience; OR a bachelor’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, and at least 10 years of such experience.
  • At least 2 years of experience applying Design of Experiments (DOE) and Statistical Process Control (SPC) methodologies in semiconductor process development and optimization.
  • At least 2 years of experience leading cross-functional semiconductor process development projects across engineering disciplines such as process engineering, integration, yield, and equipment engineering.

Nice To Haves

  • Experience with advanced Dry Etch/Plasma Etch technologies, including Through-Silicon Via (TSV) processes.
  • Experience in a semiconductor foundry or advanced technology development environment.
  • Experience with process automation systems and advanced process control methodologies.
  • Experience collaborating with semiconductor equipment suppliers on process optimization, development, and implementation.
  • Experience driving process improvements related to yield, defect reduction, process stability, and manufacturing performance.
  • Experience driving technical work groups solving complex dry etch-related problems using model-based problem solving (MBPS).
  • Demonstrated technical leadership in complex semiconductor process development initiatives involving multiple engineering teams.

Responsibilities

  • Lead development and implementation of technically sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
  • Perform process integration and develop solutions to meet device specifications for high-volume manufacturing and future technologies.
  • Conduct research and pathfinding to enable manufacturing of innovative device architectures and ensure scalability for high-volume production.
  • Develop roadmaps and strategies for technology processes aligned with Intel’s future goals while considering cost sensitivity.
  • Collaborate with equipment and materials suppliers to enable process advancements and improve production outputs.
  • Conduct feasibility studies using theoretical simulations and practical engineering methods to evaluate process technology capabilities.
  • Recommend and implement modifications to manufacturing processes and equipment to optimize efficiency, reliability, and yield.
  • Stay current on industry trends and technical advancements to drive innovation.
  • Drive technical work groups solving complex dry etch-related problems using model-based problem solving.
  • Lead cross-functional semiconductor process development projects and drive technical solutions toward project and manufacturing objectives.

Benefits

  • Competitive pay
  • Stock bonuses
  • Health benefits
  • Retirement benefits
  • Vacation
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