PIC Process Integration Engineer

Nokia•Sunnyvale, CA
•$139,000 - $200,000

About The Position

The PIC Process Integration Engineer will join Nokia’s Photonic Integrated Circuit Product Integration Team and lead the bring-up and qualification of a new Indium Phosphide (InP) photonics semiconductor fabrication facility. The role focuses on establishing high-yield, scalable, and reliable photonic device manufacturing processes in a fab environment. The engineer will support qualification of front-end and back-end equipment, develop and optimize InP-based PIC process modules, and improve yield and reliability through monitoring, metrology, statistical process control, and root-cause analysis. The role also collaborates with device design, test, and packaging teams and supports process documentation and transfer from R&D into pilot and volume production.

Requirements

  • BS, MS, or PhD in Electrical Engineering, Materials Science, or a related field.
  • Hands-on experience in compound semiconductor fabrication.
  • Understanding of semiconductor process integration, yield-improvement methodologies, and cleanroom practices.
  • Experience with fab tool bring-up and qualification, including troubleshooting and maintenance support.
  • Strong problem-solving skills and a data-driven mindset.
  • Familiarity with tools such as JMP, Python, and MES/SPC software packages.
  • Excellent communication and teamwork skills, with the ability to work in a fast-paced startup or ramp-up environment.

Nice To Haves

  • Experience with InP-based photonics is strongly preferred.
  • Experience with SPC, Design for Manufacturing (DfM), and Six Sigma principles for continuous improvement.

Responsibilities

  • Support fab start-up and drive qualification of front-end and back-end process tools for InP-based photonic device fabrication.
  • Work with process engineers and internal stakeholders to meet process and equipment milestones.
  • Develop and optimize process modules, including etch, deposition, lithography, diffusion, and metallization, for InP-based PICs.
  • Ensure process robustness and repeatability across the full device flow.
  • Establish process monitoring metrics, inline metrology strategies, and SPC to improve yield.
  • Identify root causes of process excursions or device failures and lead corrective actions using failure-analysis tools and DOE methodology.
  • Collaborate with device design, test, and packaging teams to ensure manufacturability and alignment with performance targets.
  • Develop and maintain process documentation, FMEA analyses, and qualification reports.
  • Support transfer of developed processes from R&D to pilot and volume production.

Benefits

  • Corporate Retirement Savings Plan
  • Health and dental benefits
  • Short-term disability and long-term disability
  • Company-paid life insurance and AD&D at 2x base pay
  • Optional or supplemental life and AD&D insurance for employees, spouses, and children
  • Paid holidays and vacation
  • Employee Stock Purchase Plan
  • Tuition Assistance Plan
  • Adoption assistance
  • Employee Assistance Program/Work Life Resource Program
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