The PIC Process Integration Engineer will join Nokia’s Photonic Integrated Circuit Product Integration Team and lead the bring-up and qualification of a new Indium Phosphide (InP) photonics semiconductor fabrication facility. The role focuses on establishing high-yield, scalable, and reliable photonic device manufacturing processes in a fab environment. The engineer will support qualification of front-end and back-end equipment, develop and optimize InP-based PIC process modules, and improve yield and reliability through monitoring, metrology, statistical process control, and root-cause analysis. The role also collaborates with device design, test, and packaging teams and supports process documentation and transfer from R&D into pilot and volume production.
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Job Type
Full-time