Process Integration Engineer, APTD

Micron • Boise, ID

1d

About The Position

The Advanced Packaging Technology Development (APTD) team develops packaging and integration technologies for future generations of memory products, including High Bandwidth Memory (HBM) and other advanced memory technologies. The team works across device engineering, package design, reliability, and manufacturing to turn technical advances into scalable manufacturing solutions.

As a Process Integration Engineer, you will develop and integrate advanced semiconductor process flows for next-generation memory solutions. You will lead technical programs, address complex integration issues, and influence technology decisions from concept through manufacturing transfer. The role involves collaborating across functions and using data-driven methods to deliver technologies that balance performance, yield, reliability, manufacturability, quality, cost, and schedule.

Requirements

• Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Mechanical Engineering, or a related field and 4+ years of semiconductor industry experience; or a master’s degree and 2+ years of semiconductor experience; or a PhD in a related field.
• Experience in process integration, process development, or device development, including experiment design, execution, and analysis.
• Knowledge of semiconductor process integration and memory technologies such as DRAM, NAND, or emerging memory architectures.
• Experience using JMP or similar statistical analysis tools to drive engineering decisions.
• Demonstrated ability to solve complex technical problems using data-driven methods, statistical analysis, Design of Experiments (DoE), and root-cause investigation.

Nice To Haves

• Experience with advanced packaging technologies such as wafer-level packaging, fan-out packaging, 2.5D/3D integration, TSV, bonding, or chiplet integration.
• Experience supporting technology development, qualification, and transfer into high-volume manufacturing.
• Experience using yield, reliability, electrical, or process data to identify challenges and guide technical decisions.
• Experience developing statistical models, correlation studies, and yield analyses to drive process improvements.
• Experience applying AI or machine learning tools to engineering workflows, analytics, and yield improvement initiatives.

Responsibilities

• Lead process integration projects supporting new technology development programs.
• Partner with process development, device engineering, package design, product engineering, reliability, and manufacturing teams to solve integration challenges.
• Use AI-enabled tools, statistical analysis, and engineering data to accelerate problem solving and decision-making.
• Design, implement, and analyze experiments to improve process performance, yield, variability, and reliability.
• Identify yield limiters and root causes through analysis of metrology, defect, parametric, probe, reliability, and test data.
• Drive corrective actions from root cause identification through implementation and validation.
• Develop and improve integration flows that balance performance, manufacturability, quality, reliability, cost, and schedule requirements.
• Support technology qualification, manufacturing transfer, and development activities across multiple sites.

Benefits

• Choice of medical, dental, and vision plans.
• Programs that help protect income in the event of illness or injury.
• Paid family leave.
• Paid time off.
• Paid holidays.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level