PMTS Silicon Photonics Packaging Integration

GlobalFoundries • Essex Junction, VT

23h • $131,900 - $241,500

About The Position

As a Photonic Packaging Engineer within GlobalFoundries’ Advanced Packaging and Photonics Center (APPC), you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets.

Requirements

• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or a related field.
• 15 or more years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.
• Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.
• Familiarity with die attach, flip-chip, underfill, molding, and micro-optics integration.
• Understanding of reliability standards and qualification methodologies for optical modules.
• Excellent analytical, problem-solving, and communication skills.
• Experience bringing packaged products from development into production.
• Strong written and spoken English communication skills.

Nice To Haves

• Experience with automated optical/electro-optical test setups and motion control systems, such as Python-based systems.
• Knowledge of co-packaged optics (CPO), pluggable modules, and silicon photonics ecosystems.
• Strong background in thermal/mechanical modeling and optical simulation tools, such as Lumerical and COMSOL.
• Familiarity with GlobalFoundries’ Fotonix™ platform, including 300mm monolithic SiPh integration and advanced packaging flows.
• Experience working with OSATs and managing external development partners.
• Demonstrated ability to lead cross-functional teams and influence technical direction.

Responsibilities

• Define, design, and qualify optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal and mechanical integration.
• Develop and implement scalable fiber-to-chip coupling strategies, such as V-groove, passive alignment, and lens integration, for high-density optical I/O.
• Drive heterogeneous integration of photonic and electronic components using 2.5D, 3D, and 3.5D packaging technologies, such as TSV, Cu-Cu hybrid bonding, and advanced molded integration.
• Perform thermal, mechanical, and optical multiphysics simulations to optimize package performance and reliability.
• Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and failure-analysis tools.
• Collaborate with OSATs and internal manufacturing teams to ensure mass-production readiness and process transfer.
• Support cost modeling and drive package cost-reduction initiatives aligned with GlobalFoundries’ B2B supply chain strategy.
• Present technical updates and roadmaps to internal stakeholders and external partners.
• Perform activities safely and responsibly and support Environmental, Health, Safety & Security requirements and programs.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior