Silicon Photonics & Optical Packaging Eng

Apple

1d

About The Position

The Silicon Photonics & Optical Packaging Engineer will develop silicon photonics engine and chiplet packaging and co-packaging solutions using advanced packaging technologies. The role includes defining assembly baseline processes, determining package bills of materials, and establishing optical coupling designs and manufacturing processes optimized for performance, reliability, yield, and cost.

The engineer will lead silicon photonics packaging technology development and work with cross-functional teams on optical engine modules, optical coupling and fiber-array connector design, and co-packaged optics. The position also involves developing silicon photonics-based optical engine package architectures and package integration, and driving micro-optical component assembly and interface characterization from innovation through high-volume manufacturing. The engineer will work with optical component vendors, foundries, and OSATs to bring packaging solutions from concept to high-volume manufacturing. At least 5% international travel is required.

Requirements

• Bachelor of Science degree and 10 or more years of relevant industry experience.
• Excellent teamwork and communication skills.
• Strong theoretical background in optics and photonics fundamentals and device/module integration.
• Hands-on experience packaging and measuring fiber-coupled devices.
• Hands-on experience in optical component design, simulation, and qualification.
• Experience with single-mode and multimode fiber assembly using active and passive alignment tools.

Nice To Haves

• Master's or Ph.D. in Physics (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering, or an equivalent field.
• At least 5 years of related work experience with a master's degree and/or Ph.D.
• Hands-on experience with CMOS BEOL wafer-scale processing and flip-chip assembly, including CoC, CoW, and WLP.
• Experience with silicon photonics devices such as lasers, modulators, photodetectors, and passive components such as silicon waveguides and multiplexers/demultiplexers.

Responsibilities

• Lead silicon photonics packaging technology development.
• Work with cross-functional teams on optical engine modules, optical coupling and fiber-array connector design, and co-packaged optics development.
• Develop silicon photonics-based optical engine package architectures and package integration.
• Drive micro-optical component assembly and interface characterization.
• Work with optical component vendors, foundries, and OSATs to bring silicon photonics packaging solutions from concept to high-volume manufacturing.
• Define assembly baseline processes and package bills of materials.
• Establish optical coupling designs and manufacturing processes optimized for performance, reliability, yield, and cost.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior