Silicon Photonics & Optical Packaging Eng

Apple

1d

About The Position

Silicon photonics (SiPh) technology supports next-generation optical interconnects for data-center connectivity and short-distance connections within boards. This role develops high-efficiency optical I/O module architectures, assembly methods, optical coupling designs, and processes for single-mode fiber packaging to support high-volume, low-cost applications.

The engineer develops Si photonics engine and chiplet packaging and co-packaging solutions using advanced packaging technologies. The role defines assembly baseline processes, determines package bills of materials, and establishes optical coupling designs and manufacturing approaches optimized for performance, reliability, yield, and cost. The engineer leads Si photonics packaging technology development and works with cross-functional teams on optical engine modules, optical coupling and fiber-array connector designs, and co-packaged optics. They also work with optical component vendors, foundries, and OSAT partners to bring packaging solutions from concept to high-volume manufacturing. A minimum of 5% international travel is required.

Requirements

• Bachelor’s degree and at least 3 years of relevant industry experience.
• Excellent teamwork and communication skills.
• Strong theoretical background in optics and photonics fundamentals and device/module integration.
• Hands-on experience packaging and measuring fiber-coupled devices.
• Hands-on experience in optical component design, simulation, and qualification.
• Experience with single-mode and multimode fiber assembly using active and passive alignment tools.

Nice To Haves

• Master’s or Ph.D. in physics (optics major), electrical engineering, materials science, mechanical engineering, or an equivalent field.
• At least 5 years of related work experience for candidates with a Master’s or Ph.D.
• Hands-on experience with CMOS BEOL wafer-scale processing and flip-chip assembly, including CoC, CoW, and WLP.
• Experience with silicon photonics devices such as lasers, modulators, photodetectors, and passive components such as silicon waveguides and multiplexers/demultiplexers.

Responsibilities

• Lead silicon photonics packaging technology development.
• Work with cross-functional teams and lead optical engine module, optical coupling and fiber-array connector design, and co-packaged optics development efforts.
• Develop silicon-photonics-based optical engine package architectures and package integration.
• Drive micro-optical component assembly and interface characterization through innovation.
• Work with optical component vendors, foundries, and OSAT partners to take silicon photonics packaging solutions from concept to high-volume manufacturing.
• Develop packaging and co-packaging solutions, define assembly baseline processes, determine package BOMs, and establish optical coupling design and manufacturing approaches optimized for performance, reliability, yield, and cost.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level