Silicon Photonics Packaging Engineer Co-op

Nokia • Sunnyvale, CA

9d • $20 - $70 • Onsite

About The Position

Nokia is seeking a Silicon Photonics Packaging Co-op for the Spring 2027 term to support research and development of silicon photonics transceiver modules. The co-op will develop semiconductor and optical packaging processes in-house or with contract manufacturers, and design optical transceiver packages in collaboration with cross-functional teams and stakeholders. The role owns Design Rules documents, helps ensure Design for Manufacturing specifications are met, performs mechanical integrity and thermal simulations, tolerance analyses, and characterization, and drives package debugging during product validation and qualification. The co-op will also plan and drive prototype assembly builds to support early design validation and apply advanced packaging knowledge while keeping current with new technology developments.

This is a four-month co-op with two positions, scheduled from January 2027 to June 2027. The role is onsite in Sunnyvale, California. Nokia describes itself as a global connectivity leader focused on advancing connectivity for the AI era and securing a brighter world.

Requirements

• Be a current M.S. or Ph.D. student at an accredited university in the USA, studying electrical engineering, physics, applied physics, or a similar field.
• Have experience with package and process design and development from design through production.
• Have knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
• Have experience documenting fabrication, inspection, and assembly processes.
• Have interpersonal, communication, and problem-solving skills to interact effectively with engineering staff, external vendors, and contractors.

Nice To Haves

• Understanding of optical epoxies, non-hermetic packaging, high-volume packaging, and thermal analysis of 2.5D/3D packages.
• Experience in semiconductor chip and wafer-level back-end processing, assembly, and/or packaging.
• Experience in high-speed electronics package design and/or laser package design.
• Experience with thermo-mechanical simulations using ANSYS or similar software.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
• Familiarity with optical packaging design and simulations using free-space optics or fiber coupling.

Responsibilities

• Develop semiconductor and optical packaging processes in-house or in close partnership with contract manufacturers.
• Design optical transceiver packages with cross-functional teams and stakeholders to meet package requirements.
• Own Design Rules documents and ensure Design for Manufacturing specifications are met.
• Perform mechanical integrity and thermal simulations, tolerance analyses, and characterization.
• Drive package debugging during product validation and qualification.
• Plan and drive prototype assembly builds to enable deliveries for early design validation.
• Apply in-depth knowledge of advanced packaging principles and stay current with technological advancements.

Benefits

• Flexible and hybrid working schemes to balance study, work, and life.
• Professional development events and networking opportunities.
• Well-being programs, including a confidential Personal Support Service available 24/7 to Nokia employees and their families.
• Opportunities to join Nokia Employee Resource Groups and build connections across the organization.
• Employee Growth Solutions, mentorship programs, and coaching support for career development.
• A learning environment that fosters personal and professional development.

What This Job Offers

• Career Level: Intern