Intel Corporation is seeking a detail-oriented, collaborative Packaging Module Engineering Technician to support advanced packaging technology development in Arizona. The role is part of Intel’s Advanced Packaging and Assembly team, which focuses on improving production efficiency, optimizing next-generation assembly processes, and delivering semiconductor packaging solutions. This fully on-site position is based in the Phoenix, Arizona area and works in a state-of-the-art laboratory alongside research engineers. The technician prepares samples, performs analytical testing, and evaluates materials, producing data that informs semiconductor process optimization, quality control, and failure analysis. The role includes materials characterization using microscopy, imaging, acoustic inspection, and other analytical methods; preparing samples and coupons; operating analytical and testing equipment; and supporting material evaluations, process development, and failure analysis investigations. The technician also documents and communicates findings, maintains equipment, follows laboratory safety and quality standards, and collaborates with engineering and cross-functional teams. Chemical handling, wet processing, and experiments must follow laboratory safety protocols and environmental health and safety requirements. Applicants must have either an associate or bachelor’s degree in a STEM-related discipline, with no prior professional experience required, or a high school diploma or GED plus at least one year of relevant experience. Intel states that this position is not eligible for immigration sponsorship. The role is an hourly position, with a listed annual salary range of $51,710 to $99,770 across U.S. locations; actual compensation depends on location and other job-related factors. Intel offers competitive pay, stock bonuses, and benefits including health, retirement, and vacation programs.
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Job Type
Full-time
Career Level
Entry Level
Education Level
Associate degree