Intel Corporation is seeking a detail-oriented, collaborative Packaging Module Engineering Technician to support advanced packaging technology development in Arizona. The role is based in a state-of-the-art laboratory and focuses on preparing samples, conducting analytical testing, and evaluating materials. The technician works alongside research engineers to produce analytical data used in semiconductor process optimization, quality control, and failure analysis.
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Job Type
Full-time
Career Level
Entry Level
Education Level
Associate degree