Hewlett Packard Enterprise is hiring a Packaging Engineer to support the development and maintenance of packaging solutions for HPE high-performance computing products. The role is an intermediate-level engineering position focused on designing and evaluating materials, mechanical systems, equipment, and packaging. The engineer will serve as a subject matter expert in crating, corrugated, and foam packaging systems and use testing results and performance data to recommend product and packaging designs. The position leads fragility testing for assigned projects using shock, vibration, and drop-test equipment, applies engineering principles to design challenges, and prepares technical documentation and laboratory reports. It also involves maintaining bill-of-materials documentation in support of sustainability, Extended Producer Responsibility, and CMAP requirements; identifying cost-saving opportunities; and helping manufacturing and service teams resolve product and packaging issues. The engineer works with cross-functional teams to meet program objectives. This position is based primarily at an HPE office in Chippewa Falls, Wisconsin. The expected annual base salary range is USD 74,000–170,300; actual offers may vary based on location, experience, education, training, and skills. Variable incentives may also be offered.
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Job Type
Full-time
Career Level
Mid Level