Hewlett Packard Enterprise is hiring a Packaging Engineer to support packaging solutions for HPE high-performance computing products. The role focuses on designing and maintaining crating, corrugated, and foam packaging systems, evaluating packaging and product performance, and applying engineering principles to resolve design challenges. The position is onsite, with the expectation that the employee will primarily work from an HPE office in Chippewa Falls, Wisconsin. The engineer will lead fragility testing using shock, vibration, and drop-test equipment; provide design recommendations based on test results and performance data; and prepare technical documentation and laboratory reports. The position also supports BOM documentation for sustainability, Extended Producer Responsibility, and CMAP requirements, identifies cost-saving opportunities, and helps manufacturing and service teams resolve product and packaging issues. The role works with cross-functional teams in a fast-paced environment.
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Job Type
Full-time
Career Level
Mid Level