Module Development Engineer

Intel Corporation•Hillsboro, OR

1d•$133,800 - $188,890•Onsite

About The Position

Intel's advanced packaging technology development organization is seeking a Module Development Engineer to support next-generation semiconductor packaging technology development, with a focus on 3D Integrated Circuit (3D IC) technology and advanced manufacturing processes. The engineer will contribute to developing, evaluating, and optimizing semiconductor manufacturing processes for future technology generations, working with engineering and manufacturing teams to develop process solutions, address technical challenges, and support the introduction of new technologies into the factory. The role includes process characterization and experimental evaluation, data analysis, statistical process control, design of experiments, and engineering analysis. It also involves troubleshooting process and equipment challenges, conducting root cause analysis, implementing corrective actions, collaborating across engineering disciplines, and supporting process integration, equipment development, manufacturing readiness, equipment and technology qualification, automation, and process improvement. The engineer will document development work and contribute to the development and transfer of next-generation semiconductor packaging processes. The role requires an on-site presence in Hillsboro, Oregon.

Requirements

Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM field and 4+ years of experience in semiconductor manufacturing, process development, or equipment development; OR a master's degree in one of the listed or related fields and 3+ years of such experience; OR a PhD in one of the listed or related fields, with no prior industry experience required.
At least 1 year of combined experience across statistical process control (SPC) and/or design of experiments (DOE), and semiconductor processing, system controls, or mechanical systems.

Nice To Haves

Experience programming or developing engineering solutions using Python and/or MATLAB.
Hands-on experience with robotics, equipment automation, machine vision, or image processing systems.
Experience troubleshooting semiconductor manufacturing equipment or processes, including root cause analysis and corrective action implementation.
Experience with semiconductor packaging processes, including advanced packaging technologies.
Experience with equipment development, automation development, or engineering project management.

Responsibilities

Develop, evaluate, and optimize semiconductor manufacturing processes for next-generation 3D IC and advanced packaging technologies.
Support technology development initiatives introducing new processes and manufacturing capabilities for future technology generations.
Conduct process characterization, experimental evaluations, and data analysis to identify process improvement opportunities.
Apply statistical process control (SPC), design of experiments (DOE), and engineering analysis techniques to evaluate process performance and support technology development.
Troubleshoot manufacturing process and equipment challenges, perform root cause analysis, and implement corrective actions.
Collaborate with cross-functional engineering teams on process integration, equipment development, and manufacturing readiness.
Participate in evaluating, qualifying, and optimizing manufacturing equipment and process technologies.
Work with engineering and manufacturing teams to identify opportunities for process automation, efficiency improvements, and technical innovation.
Document experimental results, technical findings, and process development activities to support engineering decisions and future technology implementation.
Contribute to the development and transfer of next-generation semiconductor packaging processes.