Memory Circuit Design Engineer

Intel Corporation•Austin, TX
•$164,470 - $269,100•Hybrid

About The Position

Intel's CPU Circuit Technology team is seeking a Memory Circuit Design Engineer to design and develop advanced memory circuits for future CPU and SoC products. The role involves developing full-custom and compiler-based SRAMs, caches, multi-ported register files, ROMs, custom memories, and associated digital circuits. The engineer partners with architecture, design, process technology, physical design, and product engineering teams to develop memory solutions focused on power, performance, area (PPA), and scalability on advanced CMOS process technologies. The position also offers opportunities to influence memory architecture, advance circuit innovation, and contribute to Intel computing platforms. The role is part of a fast-paced, high-performance, low-power CPU design team and covers technical readiness, memory circuit design, characterization, simulations, cache design, critical-path simulations, custom block design, memory path-finding, PPA optimization, memory bit-cell and complex periphery IC design and automation, memory array/IP design, innovation, methodology definition, and project schedule execution. The successful candidate will bring technical curiosity, ownership, analytical and problem-solving skills, collaboration and communication capabilities, and the ability to balance innovation with timely execution in a dynamic environment. The position is based in Austin, Texas, and is eligible for Intel's hybrid work model, with time split between the assigned Intel site and off-site work.

Requirements

  • Bachelor's degree in Electrical/Computer Engineering or a STEM-related field and 6+ years of experience; or a Master's degree in the same fields and 4+ years of experience; or a PhD in the same fields and 2+ years of educational or work experience.
  • Proficiency in CMOS circuit design, memory design, and circuit trade-offs for power, performance, and area.
  • Expertise in VLSI circuits and design methodologies.
  • Strong technical curiosity and interest in solving complex memory and circuit design challenges.
  • Ownership mindset and ability to independently drive solutions from concept through implementation.
  • Excellent analytical and problem-solving capabilities.
  • Strong collaboration and communication skills across multidisciplinary teams.
  • Ability to balance technical innovation with execution against project schedules.
  • Adaptability and effectiveness in a fast-paced, dynamic development environment.

Nice To Haves

  • Experience in low-power implementation techniques.
  • Familiarity with circuit and layout trade-offs for optimized design.
  • Knowledge of industry-standard digital circuit design tools, flows, and methodologies, dynamic simulations, variation analysis, and signal integrity analysis.

Responsibilities

  • Develop full-custom and compiler-based SRAMs, caches, multi-ported register files, ROMs, custom memories, and associated digital circuits.
  • Work with architecture, design, process technology, physical design, and product engineering experts to create memory solutions optimized for PPA and scalability.
  • Perform technical readiness work, memory circuit design, characterization, and simulations.
  • Design caches, run critical-path simulations, and design custom blocks.
  • Perform memory path-finding and PPA optimization.
  • Design and automate memory bit-cells and complex periphery ICs.
  • Design memory arrays and IP and drive memory circuit innovation.
  • Define methodologies and execute work to project schedules.

Benefits

  • Competitive pay
  • Stock bonuses
  • Health benefits
  • Retirement benefits
  • Vacation
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