HBM SoC Physical Design Engineer

Micron • Folsom, CA

1d

About The Position

As a SoC Physical Design Engineer in Micron Technology’s Heterogeneous Integration Group (HIG), you will drive implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will collaborate with RTL design, verification, DFT, IP providers, packaging and assembly, and manufacturing teams to deliver strong performance, power, and area (PPA) and robust signoff collateral for tape-out. This hands-on role offers opportunities to own blocks or top-level integration across multiple product generations. You will also help enable and integrate AI-driven tools and workflows into the team’s methodologies.

Requirements

• Strong experience in SoC physical design implementation from netlist to GDSII on advanced nodes and complex designs.
• Proficiency with industry EDA tools such as Cadence Innovus/Tempus, Synopsys ICC2/PrimeTime, Siemens Calibre, or equivalent.
• Solid understanding of STA fundamentals, clocking, SDC constraints, and common closure techniques such as buffering, path shaping, and useful skew.
• Experience with power intent and power delivery considerations, including UPF/CPF concepts, power-grid planning, and power-gating implications.
• Familiarity with physical verification and signoff concepts, including DRC, LVS, ERC, parasitic extraction awareness, and signoff handoff quality.
• Minimum 3 years of experience in a related field.

Nice To Haves

• Experience with HBM/DRAM-adjacent SoC designs or memory-subsystem-heavy SoCs.
• Bachelor’s or master’s degree in electrical engineering, computer engineering, or a related field.
• Proven ability to mentor and develop engineers early in their careers.
• Good understanding of Agentic AI, or willingness to learn Agentic AI.

Responsibilities

• Own physical implementation for SoC blocks and/or top-level designs, including floor-planning, placement, clock-tree synthesis (CTS), routing, and physical optimization to meet PPA targets.
• Drive setup and hold timing closure across multi-mode, multi-corner (MMMC) scenarios in partnership with RTL, architecture, and STA/signoff teams.
• Integrate and implement complex IP, such as controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, and PHY-adjacent logic, with a focus on physical integration, timing, and power integrity.
• Perform or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, and address violations efficiently.
• Partner with DFT teams to ensure scan and MBIST requirements are physically realizable without compromising PPA or schedule.
• Work with packaging, assembly, test, probe, and manufacturing collaborators to meet manufacturability and quality requirements.
• Support tape-out execution, including checklists, ECO flows, and signoff reviews, and contribute to post-silicon debug by correlating silicon behavior with PD/STA/power analysis.
• Identify flow gaps and improve productivity through scripting, automation, and best-practice methodology development.
• Help develop efficient workflows using Agentic AI.

Benefits

• Medical, dental, and vision plans.
• Programs to help protect income if unable to work due to illness or injury.
• Paid family leave.
• Paid time off.
• Paid holidays.
• Additional compensation may include bonuses and equity.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: No Education Listed