ATD MIHL Equipment Development Engineer

Intel Corporation•Chandler, AZ

10d•$99,030 - $188,890•Onsite

About The Position

Join Intel's Packaging Module Development team to develop and optimize processes and equipment supporting next-generation assembly and packaging solutions. The role contributes to manufacturing efficiency, product reliability, and quality. The team designs and refines packaging solutions for Intel products in collaboration with cross-functional groups. The engineer develops assembly processes and equipment, evaluates packaging technologies under simulated field conditions, ensures package-layout manufacturability, defines material specifications, and establishes reliability benchmarks. The position also leads continuous improvement and problem-solving initiatives, advises internal teams and partners, and standardizes equipment qualification practices and manufacturing quality systems to meet product milestones and mitigate technical risks. This is an onsite role in Phoenix, Arizona. The position is not eligible for Intel immigration sponsorship.

Requirements

Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field and at least 3 years of relevant experience; or a master's degree in one of these fields and at least 2 years of relevant experience; or a PhD in one of these fields.
Experience with Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
Experience with mechanical design software such as SolidWorks or AutoCAD.
Experience with mechanical drawings and Geometric Dimensioning and Tolerancing principles.
Must be eligible to work without Intel immigration sponsorship.

Nice To Haves

Program management ability to lead technical innovation and manage complex, time-sensitive projects.
Experience with semiconductor fabrication processes, packaging technologies, and robotics.
Experience with supply chain management in a manufacturing or materials qualification environment.

Responsibilities

Develop and optimize assembly processes and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability goals.
Apply Design of Experiments (DOE) and Statistical Process Control (SPC) principles to refine processes and specifications, documenting findings in technical reports.
Design and maintain equipment to evaluate packaging technologies under simulated field conditions, including temperature cycles, humidity, heat, and dynamic forces.
Ensure manufacturability of physical layouts in package design and oversee manufacturing workflow lifecycles.
Define material specifications and work with supplier quality and procurement teams to ensure quality and performance benchmarks are met.
Develop techniques, tools, and quality screens to identify and address packaging reliability challenges.
Set reliability benchmarks based on failure mechanisms and customer needs.
Lead problem-solving initiatives and continuous improvement in processes and equipment.
Provide technical consultation to internal teams and partners on packaging challenges and solutions.
Standardize equipment qualification practices and manufacturing quality systems to align with product milestones and mitigate technical risks.