Join Intel's Packaging Module Development team as an equipment development engineer contributing to innovative assembly and packaging technologies. The role develops and optimizes processes and equipment for next-generation packaging solutions, with the goal of improving manufacturing efficiency, product reliability, and quality. The team designs and refines assembly and packaging solutions across Intel's product portfolio and collaborates across functions to deliver manufacturing innovations and reliable products for global markets. The position develops and optimizes assembly processes and equipment, evaluates packaging technologies under simulated field conditions, supports manufacturable package layouts and workflows, and defines material specifications with supplier quality and procurement teams. It also addresses reliability challenges, establishes benchmarks, leads continuous improvement and problem-solving efforts, advises internal teams and partners, and standardizes equipment qualification and manufacturing quality systems.
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Job Type
Full-time
Career Level
Mid Level