Director, Package Design Engineering

Renesas Electronics•San Jose, CA

About The Position

Renesas is a global semiconductor company focused on developing solutions for automotive, industrial, infrastructure, and IoT markets. We aim to make every endpoint intelligent and contribute to a safer, healthier, greener, and smarter world. Renesas employs approximately 21,000 people across more than 30 countries and operates under a culture defined by transparency, agility, global collaboration, innovation, and entrepreneurship. The company is committed to diversity and inclusion and seeks to build a sustainable future through technology. This role involves contributing to the development of cutting-edge electronics and shaping the future of the industry.

Requirements

Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip chip packaging
Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software
Strong interpersonal and communication skills.
Strong analytical and presentation skills.

Nice To Haves

Knowledge of wafer level, flip-chip, multi-chip module and power devices will be a plus.
Knowledge of wire-bonding & multi-chip module technologies a plus.

Responsibilities

Package Technology Development/NPI, R&D, Global OSAT management for new Package Development/Product qualification, Technology Roadmap definition, R&D budget management & customer adoption programs.
Focus on design and development of package and interconnect methods for Renesas’s AI/Datacenter Infrastructure Power packaging needs especially Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FET packages.
Scope also involves WBG (Ie. SiC & GaN) development along with DBC, AMB substrates and advanced interconnect technologies.
Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
Resolve all process integration issues by ensuring all window checks are done on critical process steps.
Establish production controls and monitors to ensure there is no room for quality incidents.
Ensure smooth transition into production & implement ramp up monitor.
Work with OSAT/CM to monitor and resolve process issues early in the production phase to ensure only parts with superior quality shipped to customer.
Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects.
Participate in packaging roadmap development & focus on execution.
Address internal and external customer complaints working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
Establish & maintain package design rules.