Sr. Director, Package Development Engineering

SiTime Corporation•Santa Clara, CA

4d•$238,950 - $341,710

About The Position

SiTime is the Precision Timing company. Timing is the heartbeat of all electronics, ensuring performance, resilience and scalability. For decades, quartz devices, non-silicon technology, have kept systems in sync, but they struggle in harsher, more demanding environments. MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS timing powers over 400 applications, including high-growth ones in AI datacenters, automated driving, industrial and humanoid robots, wearables and IoT. Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power, and better reliability. With more than 4 billion devices shipped, SiTime is changing the timing industry. For more information, visit: www.sitime.com.

Requirements

Ph.D. or Master’s degree in Mechanical Engineering, Materials Science, Microelectronics, or Physics.
10+ years of experience in semiconductor packaging R&D, with at least 5 years leading teams focused on advanced heterogeneous integration.
Expertise in semiconductor materials, process integration, process engineering and metrology.
Develop workflows with EDA tool chains and calibrating measurements to attain predictive performance.
Implement automated process control strategies to ensure volume manufacturability and quality.
Demonstrated expertise in collaborating with OSATs and semiconductor foundries.
Understand differences between different supplier capabilities to establish an OSAT-specific execution framework.
Experience in managing high-performance, geographically distributed teams with centers of excellence, local decision autonomy and strong teamwork.
Strong cross-functional leadership, problem-solving and communication skills.

Nice To Haves

Strategic technology leader with the ability to define a differentiated packaging vision and translate it into executable roadmaps, milestones, and measurable business outcomes.
Deep technical curiosity and innovation mindset, with a demonstrated drive to challenge conventional packaging approaches and solve complex thermal, mechanical, materials, and manufacturability problems.
Hands-on technical credibility; able to engage at depth with engineers, suppliers, OSATs, and executives while balancing architecture, execution, quality, yield, and cost tradeoffs.
Strong collaborator and influencer who can align cross-functional teams across MEMS, IC design, process technology, product engineering, operations, quality, and external partners.
Global leadership capability, including success building and leading high-performing teams across the U.S., Taiwan, and partner locations with clear accountability and strong operating cadence.
Partner-development mindset, with the ability to build trusted, technically rigorous relationships with OSATs, foundries, equipment vendors, and materials suppliers.
Execution-oriented problem solver who thrives in ambiguity, drives rapid issue resolution, and applies structured root-cause analysis to reduce technical and program risk.
Customer and product impact orientation, with an understanding of how packaging choices affect system performance, reliability, manufacturability, supply resilience, and competitive differentiation.
High standards for engineering discipline, including data-driven decision-making, robust qualification methods, design-for-manufacturing, process control, and continuous improvement.
Talent builder and coach who attracts, develops, and retains exceptional technical talent while creating a culture of ownership, collaboration, innovation, and accountability.
Entrepreneurial and resourceful mindset, comfortable operating in a fast-paced growth environment where priorities evolve and leaders are expected to move from strategy to hands-on problem solving.
Clear executive communicator able to simplify complex technical topics, articulate tradeoffs, and influence decisions with senior leadership and external partners.
Silicon process technology development experience is a strong plus.

Responsibilities

Define the packaging roadmap that creates the technical capabilities to enable product performance, form-factor, reliability and cost.
Define package requirements and target assembly flows aligned to quality and reliability specifications.
Lead technical relationships with OSAT partners to align and implement SiTime’s packaging roadmap.
Build and manage local teams at key OSAT sites to accelerate development velocity and transfer to production.
Manage key issues and risk burn down in the design, NPI, qualification and volume phases.
Develop yield improvement and supply increase plans.
Oversee design, analysis and characterization for fit, thermal performance, structural stability, die stress, vibration immunity, and manufacturability.
Collaborate with IC design teams to optimize parasitic capacitance, resistance, and signal integrity.
Drive selection and qualification of substrates, die-attach materials, underfills, and mold compounds in alignment with suppliers.
Drive workflows to accelerate screening of alternative materials and characterization of package performance and reliability.
Define best practices and manage KPI metrics for all aspects of package development process and package lifecycle.
Track record of talent and leadership development of engineers and technicians to create high-performance, execution-focused teams.