Copy of Copy of Copy of Director, Package Design Engineering

Renesas Electronics•Dallas, TX

7h•Onsite

About The Position

Renesas is seeking a Director, Package Design Engineering to lead package technology development, R&D, and global OSAT management for new package development and product qualification. This role involves defining the technology roadmap, managing R&D budgets, and driving customer adoption programs. The focus is on the design and development of package and interconnect methods for Renesas’s AI/Datacenter Infrastructure Power packaging needs, specifically for Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages. The scope also includes Wide Bandgap (WBG) materials like SiC & GaN, DBC, AMB substrates, and advanced interconnect technologies. Experience with wafer level, flip-chip, multi-chip module, and power devices is beneficial. The position requires benchmarking, selecting, and qualifying materials, processes, and subcontractors (OSAT) or contract manufacturers (CM). Responsibilities include developing DOE to optimize processes, establishing process specifications, qualifying new packages and processes with Product groups and the Reliability team, resolving process integration issues, establishing production controls, ensuring smooth transition into production, and monitoring ramp-up. The role also involves working with OSAT/CM to resolve early production phase issues, maintaining technical expertise in power SiP/modules, wafer level packaging, and flip chip interconnects, participating in packaging roadmap development and execution, and addressing customer complaints by collaborating with Marketing, Product groups, Quality, and Operations. Establishing and maintaining package design rules is also a key responsibility.

Requirements

Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging
Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software
Strong interpersonal and communication skills.
Strong analytical and presentation skills.

Nice To Haves

Knowledge of wire-bonding & multi-chip module technologies a plus.
Knowledge of wafer level, flip-chip, multi-chip module and power devices will be a plus.

Responsibilities

Package Technology Development/NPI, R&D, Global OSAT management for new Package Development/Product qualification, Technology Roadmap definition, R&D budget management & customer adoption programs.
Focus on design and development of package and interconnect methods for Renesas’s AI/Datacenter Infrastructure Power packaging needs especially Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FET packages. Scope also involves WBG (Ie. SiC & GaN) development along with DBC, AMB substrates and advanced interconnect technologies. Knowledge of wafer level, flip-chip, multi-chip module and power devices will be a plus.
Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
Resolve all process integration issues by ensuring all window checks are done on critical process steps.
Establish production controls and monitors to ensure there is no room for quality incidents.
Ensure smooth transition into production & implement ramp up monitor.
Work with OSAT/CM to monitor and resolve process issues early in the production phase to ensure only parts with superior quality shipped to customer.
Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects.
Participate in packaging roadmap development & focus on execution.
Address internal and external customer complaints working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
Establish & maintain package design rules.