Director of Package Design

Microsoft•Redmond, WA

14h•$142,800 - $304,200

About The Position

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is responsible for powering Microsoft’s “Intelligent Cloud” mission by delivering the core infrastructure and foundational technologies for Microsoft's over 200 online businesses. The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE designs, develops, manufactures, and packages Microsoft's computer chips, including the Azure Cobalt. The Silicon Manufacturing and Product Engineering (SMPE) team is crucial in defining and delivering operational measures of success for hardware manufacturing, improving planning, quality, delivery, scale, and sustainability for Microsoft cloud hardware. This role is for a Director of Package Design to lead the advanced packaging design team and support the mission.

Requirements

Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR Equivalent Experience.
Ability to meet Microsoft, customer and/or government security screening requirements.
Must pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
Must provide proof of country of citizenship or US residency or other protected status for assessment of eligibility to access export-controlled information.
Must verify citizenship with a valid passport or other applicable documents for lawful permanent residents, refugees, and asylees.

Nice To Haves

Doctorate in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 10+ years technical engineering experience OR Master's Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 15+ years technical engineering experience OR Bachelor's Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 18+ years technical engineering experience OR equivalent experience.
15+ years of hands-on experience in Semiconductor Package design, development, manufacturing, supplier management or quality management.
Experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3D).
Foundation in advanced packaging technologies, manufacturing and supplier management.
Proficient in IC package or PCB board layout CAD tools Cadence Allegro.
Working knowledge in high-speed signaling, layout, electrical, mechanical and thermal co-designs.
Working knowledge in 2D and 3D simulation tools for full package layout extractions for power and signals analysis.
Experience with OSAT, Supplier & Foundry technologies.
Experience in physical failure analysis.
Experience in subcontract supplier management.
Experience in cross-functional team environment.

Responsibilities

Lead and mentor a team of talented package design engineers, supporting their career growth and professional development.
Drive optimal silicon packaging solution supporting Azure datacenter product roadmap.
Drive package technology for chiplet architecture with advanced 2.5D/3D packaging.
Drive 2.5D/3D packaging product designs (bridge/interposer/substrate) from definition, development to tapeout.
Define, design and develop test vehicles to validate Silicon, Package, System performance.
Drive supplier assessments and manage suppliers through definition, development, qualification and production.
Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options.
Define EDA tools requirements for advanced 3DIC packaging designs.
Design and develop package and assembly drawings to support the manufacturing.
Lead supplier assessments and manage suppliers through definition, development, qualification and production.
Assess and characterize the reliability of Integrated Circuits (IC) packages.
Design and develop package and assembly drawings to support the manufacturing.
Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
Drive execution of architecture solutions across product lines or multiple product groups and across teams that account for design trends and future concepts by leveraging cross-functional expertise, industry best practices, and lessons learned from teams working across multiple product lines.
Drive engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.