About The Position

The Defect Metrology Process Development Engineer will lead, develop, and improve automated optical inspection (AOI) and metrology processes for integrated Advanced Packaging process flows and Heterogeneous Integration (HI) platform technologies. These technologies include Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). The role is based at the company's Florida Advanced Packaging site and requires strong oral and written communication to convey ideas to foundry customers, colleagues, and management. The position supports multiple fab areas through metrology systems and measurement capabilities, reviews defect and statistical process control (SPC) data, and works with engineering teams to investigate process issues and improve device performance and yield. Other duties may be assigned. The listed duties' time percentages are estimates and may vary by position. Applicants must meet the stated education and experience qualifications. This position requires compliance with ITAR; accepted applicants must be U.S. Persons, defined here as U.S. citizens, U.S. permanent residents, political asylees, or refugees.

Requirements

  • Associate degree with prior semiconductor experience, or a BS, MS, or PhD in Electrical Engineering, Electronics Engineering, or a related engineering field.
  • For applicants with an associate degree: 5 or more years of process technician experience.
  • For applicants with a BS, MS, or PhD in Electrical Engineering, Electronics Engineering, or a related field: 0 or more years of semiconductor industry experience.
  • Knowledge of fab processing tools and experience supporting defect feedback to process owners.
  • Prior defect inspection experience.
  • MEMS, CMOS, packaging inspection, and metrology knowledge, with a relevant combination of experience and/or advanced degree.
  • Knowledge of DOE, SPC, and Six Sigma concepts and applications.
  • Clear problem-solving capability; a data-driven, inventive, solution-oriented approach; and ability to articulate thought processes.
  • Ability to work independently and in cross-functional teams to solve problems.
  • Strong oral and written communication skills for communicating with foundry customers, colleagues, and management.
  • Must be a U.S. Person as defined for ITAR compliance: U.S. citizen, U.S. permanent resident, political asylee, or refugee.

Nice To Haves

  • Project management skills and/or defined project management training.

Responsibilities

  • Lead, develop, and improve AOI and metrology processes for integrated Advanced Packaging flows and HI platform technologies.
  • Implement and maintain metrology support systems, including add-on software packages and data collection archiving.
  • Ensure metrology supports multiple fab areas with thickness and defect measurements, inspection of pillar heights and locations, and AFM and profilometry.
  • Review defects and SPC data daily for excursions, disposition issues, and opportunities to improve yield in layout and process.
  • Coordinate with appropriate engineering areas to report die pad locations through automation in FOWLP applications.
  • Investigate and drive integration changes to improve device performance and yield.
  • Work with process and tool engineers to identify processing marginalities and implement improvements.
  • Perform other duties as assigned.
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