The Defect Metrology Process Development Engineer will lead, develop, and improve automated optical inspection (AOI) and metrology processes for integrated Advanced Packaging process flows and Heterogeneous Integration (HI) platform technologies. These technologies include Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). The role is based at the company's Florida Advanced Packaging site and requires strong oral and written communication to convey ideas to foundry customers, colleagues, and management. The position supports multiple fab areas through metrology systems and measurement capabilities, reviews defect and statistical process control (SPC) data, and works with engineering teams to investigate process issues and improve device performance and yield. Other duties may be assigned. The listed duties' time percentages are estimates and may vary by position. Applicants must meet the stated education and experience qualifications. This position requires compliance with ITAR; accepted applicants must be U.S. Persons, defined here as U.S. citizens, U.S. permanent residents, political asylees, or refugees.
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Job Type
Full-time
Education Level
Associate degree