ASIC Digital Design Tech Lead

Cisco•Carlsbad, CA

About The Position

As a Digital Design Technical Leader for Silicon One Optics, you will architect digital designs for next-generation optical interconnects and own the ASIC lifecycle from initial concept through tapeout and post-silicon production. You will lead cross-functional engineering teams across digital, analog, firmware, and physical design; define digital architectures; integrate high-speed IP including ODSP, D2D IP, and SerDes XSR/PAM4; and optimize power and performance for 100G, 200G, and 400G silicon photonics and Co-Packaged Optics. The role involves driving technical strategy and delivering silicon for high-performance computing.

Requirements

  • Bachelor’s degree plus 8 years of related experience, or a master’s degree plus 6 years, or a Ph.D. plus 3 years.
  • Digital design experience with FSMs, CPU subsystems, complex SoCs, and FPGA validation.
  • Experience managing the complete ASIC/SoC design flow.
  • Experience with bus and interface protocols such as SPI, I2C, APB, and AXI, as well as high-speed SerDes, Ethernet, and D2D PHY IP.

Nice To Haves

  • Experience leading architecture and design of complex digital blocks and CPU subsystems from pre-silicon RTL through GDS2 signoff and post-silicon FPGA prototyping, lab validation, and ATE bring-up.
  • Experience developing top- and block-level specifications for high-speed datapaths and low-speed control planes, including power/timing budgeting, feedback/control system stability, and hardware-versus-firmware trade-offs.
  • Experience reviewing verification coverage metrics, independently debugging verification issues, supporting firmware-based verification and architecture, and integrating SerDes and DSP IP.
  • Hands-on experience with backend implementation activities, including synthesis, timing closure, DFT, low-power design, design automation scripting, and QOR metric processing.
  • Experience collaborating across cross-functional engineering teams to resolve technical trade-offs and complex design issues.

Responsibilities

  • Own the ASIC lifecycle from initial concept through tapeout and post-silicon production.
  • Lead cross-functional engineering teams across digital, analog, firmware, and physical design.
  • Define digital architectures and integrate high-speed IP, including ODSP, D2D IP, and SerDes XSR/PAM4.
  • Optimize power and performance for 100G, 200G, and 400G silicon photonics and Co-Packaged Optics.
  • Lead architecture and design of complex digital blocks and CPU subsystems through pre-silicon RTL, GDS2 signoff, FPGA prototyping, lab validation, and ATE bring-up.
  • Develop top- and block-level specifications for high-speed datapaths and low-speed control planes, including power and timing budgets, feedback/control system stability, and hardware-versus-firmware trade-offs.
  • Review verification coverage metrics, debug verification issues, support firmware-based verification and architecture, and integrate SerDes and DSP IP.
  • Perform backend implementation activities, including synthesis, timing closure, DFT, low-power design, design automation scripting, and QOR metric processing.
  • Collaborate across engineering teams to resolve technical trade-offs and complex design issues.
  • Drive technical strategy and interconnect innovations.

Benefits

  • Medical insurance
  • Dental insurance
  • Vision insurance
  • 401(k) plan with Cisco matching contribution
  • Paid parental leave
  • Short- and long-term disability coverage
  • Basic life insurance
  • Paid holidays
  • Floating holiday for non-exempt employees
  • Paid day off for employee’s birthday
  • Paid year-end holiday shutdown
  • Personal wellness days
  • Vacation time or flexible vacation time off, depending on employee classification
  • Sick time off
  • Additional paid time away for critical or emergency family issues
  • Optional paid volunteer days
  • Annual bonuses for eligible non-sales roles
  • Potential Cisco restricted stock unit grants
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