Advanced Packaging Development Engineer

Intel•Chandler, AZ

1d•Hybrid

About The Position

As a Packaging Module Development Engineer in Intel's Advanced Packaging Technology Manufacturing (APTM) organization, you will drive the design and optimization of packaging processes and equipment for next-generation semiconductor technologies. You will develop solutions that enhance reliability, manufacturability, and performance in high-volume manufacturing. The work supports packaging technologies for high-performance, edge, and mobile computing applications and contributes to Intel's technology development and customer success. The role includes developing and qualifying assembly processes, materials, and equipment; using experimental methods to improve outcomes; and collaborating across teams and with suppliers. You will document technical findings and support process and equipment performance in both development and high-volume manufacturing environments. The position is eligible for Intel's hybrid work model, with time split between the assigned Intel site and off-site work.

Requirements

Bachelor's degree in Engineering, Physics, Chemistry, or a related STEM field and 3 or more years of industry experience; or a master's degree in one of these fields and 2 or more years of industry experience; or a PhD in one of these fields with no prior professional experience.
Experience with process development and/or equipment qualification for manufacturing applications.
Strong communication skills for collaboration across diverse teams and stakeholders.
Strong analytical skills, including data analysis and risk assessment.

Nice To Haves

Experience leading technical teams and collaborating across matrixed organizations to drive innovation.
Experience in Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques.
Experience with semiconductor fabrication processes, packaging flows, and assembly methodologies.
Ability to deliver results in time-sensitive technical projects with a focus on process improvement.
Knowledge of quality systems, documentation standards, and tools for packaging reliability evaluation.
Proficiency in programming languages such as Python, MATLAB, or SQL to analyze complex datasets.

Responsibilities

Develop, optimize, and qualify packaging assembly processes, materials, and equipment to meet quality, reliability, yield, and cost targets.
Drive experimental design using methodologies such as Statistical Process Control (SPC) and Design of Experiments (DOE).
Develop new techniques, materials, and tools to address packaging reliability and manufacturability challenges.
Collaborate with cross-functional teams to mitigate technical risks and support product development success.
Establish process specifications and material requirements, working with suppliers to meet quality standards.
Document technical findings, process improvements, and advancements in reports and technical papers.
Support equipment performance and process health in development and high-volume manufacturing environments.