Advanced Packaging Development Engineer

Intel Corporation•Chandler, AZ

1d•$133,800 - $188,890•Hybrid

About The Position

As a Packaging Module Development Engineer in Intel Corporation’s Advanced Packaging Technology Manufacturing (APTM) organization, you will develop and optimize packaging processes and equipment for next-generation semiconductor technologies. The work supports reliability, manufacturability, performance, quality, yield, and cost objectives in development and high-volume manufacturing environments. APTM develops and scales semiconductor packaging solutions that support high-performance, edge, and mobile computing applications.

Requirements

Bachelor’s degree in Engineering, Physics, Chemistry, or a related STEM field and 3+ years of industry experience; or a master’s degree in one of these fields and 2+ years of industry experience; or a Ph.D. in one of these fields with no prior professional experience.
Experience with process development and/or equipment qualification for manufacturing applications.
Strong communication skills for collaborating across teams and stakeholders.
Strong analytical skills, including data analysis and risk assessment.

Nice To Haves

Experience leading technical teams and collaborating across matrixed organizations to drive innovation.
Experience with Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques.
Experience with semiconductor fabrication processes, packaging flows, and assembly methodologies.
Ability to deliver results on time-sensitive technical projects with a focus on process improvement.
Knowledge of quality systems, documentation standards, and tools for packaging reliability evaluation.
Proficiency in programming languages such as Python, MATLAB, or SQL for complex data analysis.

Responsibilities

Develop, optimize, and qualify packaging assembly processes, materials, and equipment to meet quality, reliability, yield, and cost targets.
Design and drive experiments using methodologies such as Statistical Process Control (SPC) and Design of Experiments (DOE).
Develop new techniques, materials, and tools to address packaging reliability and manufacturability challenges.
Collaborate with cross-functional teams to mitigate technical risks and support successful product development.
Establish process specifications and material requirements, working with suppliers to meet quality standards.
Document technical findings, process improvements, and advancements in reports and technical papers.
Support equipment performance and process health in development and high-volume manufacturing environments.