Advanced Package Technology Engineer

Broadcom • Fort Collins, CO

5d

About The Position

As a key member of the Worldwide (WW) ASIC Product Development team, the Advanced Package Technology Engineer collaborates with silicon and package design, marketing, NPI, assembly and substrate suppliers, and customers. The role leads development of cost-effective, high-performance advanced custom packaging solutions that meet signal integrity, thermal, structural reliability, design rule, and schedule requirements. It focuses on 2.5D and 3D technologies and advanced architectures for future customer and product demands.

The position leads packaging technology and partner programs, supports design wins, NPI, high-volume manufacturing ramps, and alternate sourcing and qualification efforts. It works with internal technical teams and global external partners. Periodic travel may be required.

Requirements

• Ph.D. or master's degree in Mechanical, Electrical, or Electronics Engineering.
• 10+ years of relevant experience.
• Proven experience developing cost-effective, high-performance single- and multi-chip solutions optimized for speed, density, pin count, thermal performance, and reliability.
• Experience with large, complex, custom, fine-pitch flip-chip packaging using advanced multi-layer ceramic or organic substrates, interposers, and wafer-level packaging solutions.
• At least 6 years of hands-on experience in 2.5D/3D package development and heterogeneous integration.
• In-depth understanding of advanced silicon fabrication, bumping, interposer, substrate, and assembly processes; materials selection; supplier evaluation; BOM definition; and thermal-mechanical interactions.
• Comprehensive knowledge of silicon, package, and substrate technologies, design rules, failure analysis techniques, materials, equipment, and industry standards and quality systems.
• Hands-on experience with thermal and mechanical modelling tools and substrate/PCB design CAD tools such as APD, AutoCAD, or SolidWorks.
• Understanding of advanced-node silicon fabrication, PCB technologies, and board assembly processes.
• Strong analytical, problem-solving, project management, interpersonal, and communication skills; ability to manage multiple programs concurrently and collaborate with global internal and external teams.
• Self-driven, flexible, agile, results-oriented team player able to structure projects and develop solutions to complex problems.

Responsibilities

• Serve as the subject matter expert in 2.5D and 3D advanced packaging, engaging customers to define needs, consolidate requirements, and drive unified solutions.
• Lead identification, development, and qualification of advanced packaging solutions.
• Oversee program management with external assembly and memory partners to define technology and quality requirements.
• Collaborate with internal Design Integration, Package Design, and Test Development teams.
• Support new design wins, New Product Introduction (NPI), and high-volume manufacturing ramps.
• Drive alternate sourcing and qualification initiatives.
• Develop cost-effective, high-performance custom packaging solutions that meet signal integrity, thermal, structural reliability, design rule, and schedule requirements.

Benefits

• Discretionary annual bonus
• Competitive new hire equity grant and annual equity awards
• Medical, dental, and vision plans
• 401(k) participation with company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• Company-paid holidays
• Paid sick leave and vacation time
• Paid Family Leave and other leaves of absence in accordance with applicable laws

What This Job Offers

• Job Type: Full-time
• Career Level: Senior