Advanced Package Technology Engineer

Broadcom • San Jose, CA

4d

About The Position

As a key member of the Worldwide (WW) ASIC Product Development team, the Advanced Package Technology Engineer collaborates with silicon and package design, marketing, NPI, assembly and substrate suppliers, and customers. The role leads development of cost-effective, high-performance advanced custom packaging solutions that satisfy signal integrity, thermal, structural reliability, design-rule, and schedule requirements. It helps drive 2.5D and 3D packaging architectures to meet future customer and product needs.

The role serves as a subject matter expert in advanced packaging, leads development and qualification of solutions with external assembly and memory partners, and works across internal technical teams. It supports new design wins, New Product Introduction (NPI), high-volume manufacturing ramps, and alternate sourcing and qualification initiatives. Periodic travel may be required.

Broadcom describes a competitive benefits package, including medical, dental, and vision plans; 401(k) participation with company matching; an Employee Stock Purchase Program; an Employee Assistance Program; company-paid holidays; paid sick leave and vacation; and leaves of absence in accordance with applicable laws. The role is also eligible for a discretionary annual bonus and new-hire and annual equity awards, subject to applicable plan documents and award agreements.

Requirements

• Ph.D. or Master's degree in Mechanical, Electrical, or Electronics Engineering.
• 10+ years of relevant experience.
• Proven experience developing cost-effective, high-performance single- and multi-chip packaging solutions optimized for speed, density, pin count, thermal performance, and reliability.
• Experience with large, complex, custom, fine-pitch flip-chip packaging solutions using advanced multi-layer ceramic or organic substrates and interposers, as well as wafer-level packaging solutions.
• 6+ years of hands-on experience in 2.5D/3D package development and heterogeneous integration.
• In-depth understanding of advanced silicon fabrication, bumping, interposer, substrate, and assembly processes; materials selection; supplier evaluation; BOM definition; and thermal-mechanical interactions.
• Comprehensive knowledge of current and emerging silicon, package, and substrate technologies, design rules, failure analysis techniques, materials, equipment, and industry standards and quality systems.
• Hands-on experience with thermal and mechanical modeling tools and substrate/PCB design CAD tools, such as APD, AutoCAD, or SolidWorks.
• Solid understanding of advanced-node silicon fabrication, PCB technologies, and board assembly processes.
• Strong analytical, problem-solving, project management, and interpersonal skills; ability to manage multiple programs concurrently and develop structured projects to address complex problems.
• Excellent communication skills for collaboration with global internal and external teams and customers.

Responsibilities

• Serve as a subject matter expert in 2.5D and 3D advanced packaging technologies; engage with current and future customers to define needs, consolidate requirements, and drive unified solutions.
• Lead identification, development, and qualification of advanced packaging solutions.
• Manage programs with external assembly and memory partners to define technology and quality requirements.
• Collaborate with internal technical teams, including Design Integration, Package Design, and Test Development.
• Support new design wins, New Product Introduction (NPI), and high-volume manufacturing ramps.
• Drive alternate sourcing and qualification initiatives.

Benefits

• Discretionary annual bonus
• Competitive new-hire equity grant and annual equity awards, subject to applicable plan documents and award agreements
• Medical, dental, and vision plans
• 401(k) participation with company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• Company-paid holidays
• Paid sick leave and vacation time
• Paid Family Leave and other leaves of absence in accordance with applicable laws

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: Ph.D. or professional degree