Test Module Development Engineer

Intel Corporation•Chandler, AZ

7d•$99,030 - $139,810•Onsite

About The Position

Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division driving the next generation of semiconductor packaging solutions. The team focuses on groundbreaking technologies that extend beyond traditional methods to enable the future of high-performance computing. Primary Focus: • Advanced semiconductor packaging technologies beyond conventional approaches • 3D packaging innovations and chiplet integration • High‑performance computing packaging for data centers and AI applications • Heterogeneous integration across diverse chip technologies • Scaling packaging density while enhancing thermal and electrical performance Key Objectives: • Advance Moore's Law through cutting‑edge packaging technologies • Reduce system‑level power consumption while improving overall performance • Support Intel's IDM 2.0 strategy and Intel Foundry Services • Develop packaging solutions tailored to emerging workloads such as AI and edge computing

Requirements

Bachelor's degree in engineering, physics, chemistry or related STEM field with 1+ years of industry experience.
OR Master's degree in engineering, physics, chemistry or related STEM field.
The experience outlined above should reflect any of the following core competencies: - Electrical test–related experience - Application of statistical controls - FMEA and/or DOE methodologies

Responsibilities

Executes test technology development and enablement for high‑mix, low‑volume testing and future technologies, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
Implements design and development of technically sophisticated test processes and/or repair reverse engineering, including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
Executes pathfinding and development activities in support of the Intel Foundry advanced packaging roadmap.
Implements modifications for test equipment/collateral to improve efficiency, manufacturing techniques, and optimize production output for existing products.
Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.
Executes technology feasibility studies through theoretical simulations and/or practical engineering methods.
Remains updated on relevant industrial process and materials manufacturing trends and develops a perspective on the Intel Foundry Advanced Packaging roadmap to drive industry leadership by collaborating with vendor ecosystems for cost‑effective solutions.