Packaging Module Development Engineer
About The Position
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: Provide mechanical modeling support for a variety of R&D projects ranging from Pathfinding, Technology Development, and High-Volume Manufacturing (HVM) issue resolution. Work with Equipment and Process Engineers to define problem statement and boundary conditions. Apply expertise to conduct theoretical analysis and/or numerical modeling to find solution path. Seek opportunities to improve equipment design and process definition. Projects covering First Level/Second Level Interconnect (FLI/SLI), Thermal solutions, and SMT/PCB technologies to support Intel's future packaging platforms. Keep up with latest development in computational mechanics field. Continue to seek opportunities to improve modeling capability and methodology related to semiconductor packaging applications. Engage with engineers of different job roles and different process steps to have broader understanding of semiconductor packaging technologies.
Requirements
- Ph.D. degree in Applied Mechanics, Mechanical Engineering, Aerospace Engineering, Civil Engineering, or related Stem field.
- 8+ years of experience in computational mechanics. (mechanical modeling / thermo-mechanical modeling)
- 8+ years of experience with commercial FEA software. (Ansys / Abaqus)
Nice To Haves
- Understanding in both solid/fluid mechanics theory and experimental mechanics.
- Able to convert real world problems into mechanical models.
- Understanding of semiconductor fabrication processes and technology with technical and analytical skills
Responsibilities
- Provide mechanical modeling support for a variety of R&D projects ranging from Pathfinding, Technology Development, and High-Volume Manufacturing (HVM) issue resolution.
- Work with Equipment and Process Engineers to define problem statement and boundary conditions.
- Apply expertise to conduct theoretical analysis and/or numerical modeling to find solution path.
- Seek opportunities to improve equipment design and process definition.
- Keep up with latest development in computational mechanics field.
- Continue to seek opportunities to improve modeling capability and methodology related to semiconductor packaging applications.
- Engage with engineers of different job roles and different process steps to have broader understanding of semiconductor packaging technologies.
Benefits
- We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel.
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Education Level
Ph.D. or professional degree
Number of Employees
5,001-10,000 employees
