Advanced Packaging Module Development Engineer
About The Position
Join Intel's Advanced Packaging Technology Development team as an Advanced Packaging Research and Development Engineer where you will drive innovation and help shape the future of advanced IC packaging solutions. In this role, you will play a critical part in optimizing processes and equipment to meet Intel's ambitious roadmap for assembly packaging platform technologies. In this role, you will be responsible for process and equipment development at the module level, driving solutions that meet Intel’s stringent requirements for quality, reliability, yield, cost, and productivity. You will apply a strong understanding of process characterization, equipment capability, and statistical methodologies to enable manufacturability aligned with Intel’s advanced packaging roadmap. Working within a highly cross-functional, world-class engineering team, you will help solve complex technical challenges, introduce innovative process improvements, and ensure Intel remains a technology leader in advanced packaging.
Requirements
- Must possess a Bachelor's degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a closely related field.
- Experience with process development, equipment adjustment, and manufacturing process control.
- Design of experiments (DoE) principles and statistical data analysis.
- Experience in process characterization and statistical process control methodologies.
- Analytical skills and experience troubleshooting integrated technology issues.
- Experience with materials testing and characterization techniques such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM.
Nice To Haves
- Master's degree with 3+ years or PhD degree with 0 years of experience in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a closely related field.
- Proficiency in statistical tools, Microsoft Office software suite applications, and process control software/frameworks.
- Experience working with organic and inorganic materials in packaging processes.
- Previous related work experience in a semiconductor foundry preferred.
Responsibilities
- Develop and optimize panel level processes and equipment to support Intel's advanced packaging technologies.
- Establish process specifications and equipment configurations for new technologies and integrate these into production workflows.
- Apply principles of design of experiments (DoE) to characterize process windows and understand interactions between equipment, materials, and processes.
- Drive continuous improvements in process capability, quality, reliability, cost, and yield while enhancing automation and productivity.
- Collaborate with cross-functional teams to identify and mitigate risks in packaging technology development and ensure milestone achievement.
- Lead efforts to innovate and improve equipment and processes using statistical methods and experimental design.
- Document process improvements and advancements through technical white papers and data analysis reports.
- Engage with internal and external stakeholders to address packaging challenges and deliver solutions aligned with Intel's goals.
Benefits
- We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees
