Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

1d•Hybrid

About The Position

Join Intel's Packaging Module Development team and play a pivotal role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will develop innovative material and design solutions that drive Intel's roadmap for next-generation assembly and packaging solutions. Your contributions will directly impact the efficiency, reliability, and quality of Intel's manufacturing operations, enabling cutting-edge technologies to thrive in competitive markets. This is an excellent opportunity to work on complex challenges, collaborate with cross-functional teams, and lead advancements that redefine industry standards. Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Requirements

Bachelor's degree in Materials Science and Engineering, Metallurgical Engineering or Mechanical Engineering or related field with 2+ years of relevant experience.
OR Master's degree in Materials Science and Engineering, Metallurgical Engineering or Mechanical Engineering or related field.
Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
Experience in developing innovative solutions using fundamental science and engineering concepts.
Mechanical design software such as SolidWorks or AutoCAD.
Mechanical drawings and Geometric Dimensioning and tolerancing (GD and T)

Nice To Haves

PhD degree in Materials Science and Engineering, Metallurgical Engineering or Mechanical Engineering or related field.
Demonstrated ability to lead technical innovation and manage complex, time-critical technical projects.
Familiarity with high precision manufacturing of metallic materials, such as stamping and CNC machining
Understanding of semiconductor fabrication processes and technologies.
Familiarity with supply chain management in a manufacturing or materials qualification environment

Responsibilities

Develop and qualify thermal material solutions such as Integrated Heat Spreaders (IHS) aligned with Intel's packaging technology roadmap.
Define specifications for incoming materials that meet yield, reliability, quality and cost targets through close collaboration with internal partners (module, supply chain, design, core competency and integration teams) and external suppliers
Develop manufacturing design rules by balancing design for performance (DFP), design for manufacturability (DFM) and design for cost (DFC) principles
Own technical root cause finding and problem solving for material-related issues that arise during both development and high-volume manufacturing
Continuously improve the business processes and best-known methodologies for designing and enabling high performance thermal material solutions in high volume based on evolving product requirements