Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

1d•$115,110 - $219,550•Onsite

About The Position

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. As a Packaging Module Development Engineer, you will contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms. You will collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. You will drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities. You will lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing. You will manage projects to ensure alignment with product development schedules and execution milestones. You will apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges. You will provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments and respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events.

Requirements

Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.
Experience listed above should be a combination of the following: Programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts.

Nice To Haves

One or more years of experience in one or more of the following areas: Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
Delivery of results for complex, time-critical technical projects.
Semiconductor fabrication processes and technologies.
Prior related work experience within a semiconductor foundry.

Responsibilities

Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms.
Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities.
Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing.
Manage projects to ensure alignment with product development schedules and execution milestones.
Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges.
Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments.
Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events.