Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

1d•Hybrid

About The Position

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel's future packaging platforms. This role involves collaborating with multifunctional and cross-organizational teams to develop assembly equipment and optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. The engineer will also innovate next generation equipment, materials, and fabrication processes to enhance semiconductor packaging capabilities at scale, manage equipment development (including pathfinding, new equipment definition, equipment selection, technology development, and high-volume manufacturing), and manage projects to meet product development timelines. Additionally, the role requires applying formal education and judgment to solve technical problems, providing sustaining support for equipment performance and process health in high-volume manufacturing, and responding promptly to foundry customer requests and events.

Requirements

PhD degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field; OR Master’s degree in mechanical engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field.
Candidates who are within four (4) months of completing the required degree are eligible to apply.
Minimum 1+ years of experience in Mechanical design, equipment development, or manufacturing systems, preferably within semiconductor or advanced manufacturing environments.
Strong experimental background, including hands-on laboratory or prototype development experience.
At least one first-author publication in a peer-reviewed technical journal for PhD candidates.

Nice To Haves

Technical leadership, strategic planning, and critical thinking.
Ability to coach and develop technical teams.
Tolerance for ambiguity and adaptability in a dynamic environment.
Flexibility in managing changing priorities and responsibilities.
Experience leading teams in a highly matrixed organization.
Initiative and ability to work independently.
Strong communication, influencing, technical, and analytical skills.

Responsibilities

Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel's future packaging platforms.
Collaborating with multifunctional and cross-organizational teams to develop assembly equipment and optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
Innovating next generation equipment, materials, and fabrication processes to enhance semiconductor packaging capabilities at scale.
Managing equipment development, including pathfinding, new equipment definition, equipment selection, technology development, and high-volume manufacturing.
Managing projects to meet product development timelines.
Applying formal education and judgment to solve technical problems.
Providing sustaining support for equipment performance and process health in high-volume manufacturing.
Responding promptly to foundry customer requests and events.