Packaging Module Development ENgineer

Intel Corporation•Chandler, AZ

1d•$115,110 - $219,550•Onsite

About The Position

Join Intel's Advanced Packaging Technology Development organization as a Packaging Module Development Engineer. In this critical role, you will drive the development and optimization of processes and equipment that enable Intel's future assembly packaging platform technologies. Your contributions will directly impact the manufacturability and reliability of next-generation products, ensuring Intel remains a leader in advanced IC packaging solutions. You will collaborate with cross-functional teams to develop innovative methods, solve complex engineering challenges, and design processes to meet quality, cost, yield, and productivity targets. This is an opportunity to shape the future of packaging technology while working within a dynamic and supportive environment that values creativity and collaboration.

Requirements

MS degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a closely related field and 4+ Years Relevant Experience.
OR PHD degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a closely related field and 2+ Years Relevant Experience
Experience in electrochemistry, electrolytic and/or electroless processes.

Nice To Haves

Experience with process development, equipment adjustment, and manufacturing process control.
Proficiency in design of experiments (DOE) principles and statistical data analysis.
Experience in process characterization and statistical process control.
Familiarity with materials testing and characterization techniques such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM.
Strong analytical skills and experience troubleshooting integrated technology issues.
Proficiency in statistical tools, process control frameworks, and Microsoft Office software suite applications.
Experience working with organic and inorganic materials in packaging processes.

Responsibilities

Develop and optimize panel-level processes and equipment to enable Intel's advanced packaging technologies.
Characterize process windows using principles of design of experiments (DOE) and analyze interactions among equipment, materials, and processes.
Establish equipment configurations, process specifications, and workflows for new technologies, integrating them into production.
Drive continuous improvements in process capability, quality, reliability, cost, and yield while enhancing automation and productivity.
Develop and maintain equipment capable of testing silicon and package technologies under simulated field conditions including heat, humidity, temperature cycling, and dynamic forces.
Collaborate with supplier quality and procurement teams to ensure material specifications and vendor performance meet stringent quality standards.
Lead efforts to develop novel techniques, methods, and tools to accelerate technology maturity and identify risks early in the product development cycle.
Document advancements and improvements through technical white papers and data analysis reports.
Partner with engineering teams and external stakeholders to address packaging challenges, ensuring alignment with Intel's roadmap.