Technician IV - Engineering
About The Position
The Technician IV – Engineering plays a critical hands-on role in supporting semiconductor device assembly, process development, and new product introduction (NPI). This position works closely with engineering and operations teams to execute, sustain, and improve manufacturing processes for semiconductor and MMIC chip-and-wire assemblies. This role is highly hands-on, with primary responsibility for supporting die attach and wire bonding processes, prototype builds, and production activities. The technician contributes to process optimization, troubleshooting, and continuous improvement initiatives to ensure high-quality, reliable, and efficient manufacturing operations.
Requirements
- Minimum of 5–7 years of experience in a semiconductor or electronics manufacturing environment
- Strong hands-on experience with die attach and wire bonding equipment and processes
- Ability to read and follow detailed work instructions, process flows, and technical drawings
- Proficiency with Microsoft Office tools, especially Excel for data tracking and reporting
- Strong troubleshooting skills with attention to detail in a cleanroom or controlled manufacturing environment
- Effective communication skills and ability to work cross-functionally in a fast-paced environment
- Demonstrated ability to work independently with minimal supervision while managing priorities and maintaining high-quality standards in a fast-paced manufacturing environment
Nice To Haves
- Experience with chip-and-wire assembly and MMIC device handling
- Hands-on experience with materials such as Au/Sn, Au/Ge, SAC305, conductive epoxies, and silver sintering
- Familiarity with gold wire bonding, encapsulation, and inspection processes
- Experience working to MIL-PRF-19500 and/or MIL-PRF-38534 standards
- Knowledge of IPC-600 requirements and PCB assembly processes
- Prior experience training or mentoring technicians in a production environment
Responsibilities
- Serve as a key technical liaison between Engineering and Operations to support execution and sustainment of assembly processes for assigned product lines
- Set up, operate, and maintain equipment used in die attach, wire bonding, and related semiconductor assembly processes
- Perform hands-on troubleshooting of process and equipment issues; escalate and assist in root cause investigations as needed
- Collect and analyze production data to support yield improvement, process stability, and continuous improvement efforts
- Ensure adherence to applicable industry and military standards, including MIL-PRF-19500, MIL-PRF-38534, and IPC-600
- Develop and maintain work instructions, process documentation, and training materials to ensure consistency in manufacturing operations
- Train and mentor junior technicians and operators on equipment, processes, and best practices
- Support routine production activities, including inspections, rework, and process verification
Benefits
- health benefits that begin day one
- retirement savings plans
- industry leading ESPP program with a 2 year look back feature
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Education Level
No Education Listed
