Substrate Process & Test Technology Development
About The Position
Lead the development, qualification, and manufacturing enablement of next-generation substrate technologies supporting AMD's advanced packaging roadmap. The role focuses on substrate process development, test vehicle strategy, yield optimization, process characterization, and rapid identification of technology risks during development and manufacturing ramp. The position drives substrate technology maturity from concept through high-volume production by developing process solutions, qualification methodologies, and test structures that accelerate learning cycles and improve manufacturing robustness. It works closely with substrate suppliers, OSATs, product engineering, and manufacturing teams to enable package substrate technologies with strong quality, yield, and reliability. The ideal candidate is a recognized technical leader with deep expertise in substrate manufacturing processes, test methodologies, materials interactions, process integration, failure analysis, yield engineering, and technology qualification. They understand substrate fabrication and have successfully developed and industrialized advanced substrate technologies. They apply data-driven engineering to complex manufacturing challenges and partner extensively with suppliers to optimize yield, reliability, and process capability.
Requirements
- Deep expertise in substrate manufacturing processes, test methodologies, materials interactions, process integration, failure analysis, yield engineering, and technology qualification.
- Strong understanding of substrate fabrication processes and a record of developing and industrializing advanced substrate technologies.
- Extensive experience in substrate process development, process integration, and manufacturing engineering.
- Strong background in yield engineering, defect reduction, statistical process control, and process characterization.
- Experience developing test vehicles and qualification methodologies for advanced substrate technologies.
- Strong understanding of reliability physics and failure analysis methodologies.
- Proven success in manufacturing ramp support and yield improvement leadership.
- Experience working directly with substrate suppliers and OSAT partners.
- Ability to communicate complex manufacturing and technical issues to executive leadership.
Nice To Haves
- Semiconductor packaging experience.
- Hands-on experience with ABF (Ajinomoto Buildup Film) substrates, advanced HDI (high density interconnect) technologies, fine-line processes, and advanced via structures.
Responsibilities
- Lead development and qualification of advanced package substrate technologies for future AMD products.
- Drive process integration across substrate manufacturing flows, including imaging, lamination, via formation, metallization, plating, surface finish, and assembly interfaces.
- Define process capability requirements and technology readiness criteria for new substrate platforms.
- Develop and evaluate next-generation substrate materials and process innovations.
- Define substrate test vehicle strategies to evaluate technology capabilities, process margins, and manufacturability.
- Lead development of characterization methodologies for process capability assessment and technology qualification.
- Establish learning plans that accelerate process development and supplier technology readiness.
- Develop critical process monitors and technology health indicators.
- Drive yield learning activities across development and production phases.
- Lead root-cause analysis and corrective actions for substrate-related manufacturing excursions.
- Develop statistical methodologies and process control strategies to improve manufacturing robustness.
- Partner with suppliers to improve defect density, process capability, cycle time, and manufacturing efficiency.
- Establish yield roadmaps and drive continuous cost reduction initiatives.
- Develop qualification plans and reliability assessment methodologies for emerging substrate technologies.
- Lead technology risk assessments and mitigation planning.
- Support customer qualification, technology certification, and manufacturing release activities.
- Partner with reliability engineering teams to identify and resolve process-induced failure mechanisms.
- Engage substrate suppliers, OSATs, and material vendors to develop process innovations.
- Evaluate supplier technology readiness and manufacturing capability.
- Influence supplier roadmaps for future substrate and material technologies.
- Drive technical problem-solving across the supply chain.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
Education Level
No Education Listed
