Packaging Substrate Engineer

Apple

23h

About The Position

The Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple’s internal and custom external hardware components used in consumer products such as iPhone, iPad, Mac, Apple Watch, and Apple TV. In this highly visible role, the Packaging Substrate Engineer owns and drives sophisticated package selection and optimization of next-generation package structures and configurations. The engineer is responsible for package substrate design, technology, manufacturing, reliability, and future roadmap, working with cross-functional teams to achieve the best package performance.

The role leads SoC package substrate technology development, pathfinding, and roadmap definition. It works with the substrate manufacturing industry, foundries, and OSATs to take package substrate solutions from concept to high-volume manufacturing (HVM), and drives sophisticated package solutions, new architectures, materials, process development, and specification definition. International travel is 5%.

Requirements

• Bachelor of Science degree and 10+ years of relevant industry experience.
• Fundamentals in materials, chemistry, or mechanical engineering.
• In-depth knowledge of substrate technology, manufacturing processes, design rules, and roadmaps.
• Hands-on experience in substrate manufacturing and technology development, including copper plating, lithography, dielectric materials, via formation, solder resist, or surface finish.
• Exceptional technology development and project management skills.
• Strong communication and collaboration skills.

Nice To Haves

• Master’s degree or Ph.D. and 8+ years of relevant industry experience.
• Familiarity with package assembly and integration processes.
• Experience with Cadence Allegro platform tools and design-for-manufacturing (DFM) reviews.

Responsibilities

• Lead SoC package substrate technology development, pathfinding, and roadmap definition.
• Work with the substrate manufacturing industry, foundries, and OSATs to bring package substrate solutions from concept to high-volume manufacturing.
• Drive sophisticated package solutions, new architectures, material and process development, and specification definitions.
• Own and drive package selection and optimization of next-generation package structures and configurations.
• Take responsibility for package substrate design, technology, manufacturing, reliability, and future roadmap.
• Work with cross-functional teams to achieve the best package performance.
• Travel internationally 5%.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior