Packaging Engineer

Texas Instruments • Dallas, TX

7h

About The Position

As a member of Texas Instruments' packaging team, the Packaging Engineer will work with multiple product groups and functions on high-visibility projects, with opportunities for growth within the team and across the Package Technology Solutions organization. The role focuses on developing packaging materials and technologies for power devices, particularly for datacenter and automotive applications. The engineer will collaborate with product lines, assembly and test sites, suppliers, and other product groups to define requirements, co-design and qualify packages, assess tradeoffs, and introduce new processes into production.

Requirements

• Bachelor's degree in Electrical Engineering, Materials Engineering, Mechanical Engineering, or a related engineering field.
• At least 5 years of experience working as an engineer on projects with substantial packaging activities.

Nice To Haves

• Ability to perform packaging tradeoffs between system performance, package design, cost, manufacturability, and reliability.
• Ability to design packages with an emphasis on power efficiency.
• Understanding of inductor design and manufacturing.
• Ability to work with assembly sites to ramp new processes.
• Understanding of manufacturing impact on quality.
• Understanding of best practices for ensuring supplier quality.

Responsibilities

• Develop and enhance substrates, mold compound, and other packaging materials for power devices, with a focus on datacenter and automotive applications.
• Collaborate with product lines, AT sites, and suppliers to define package requirements and roadmaps for power devices.
• Co-design and qualify new power packages and capabilities with various product groups.
• Evaluate tradeoffs between system performance, package design, cost, manufacturability, and reliability.
• Use thermal and mechanical modeling to inform package technology choices and design tradeoffs.
• Coordinate the introduction of new package processes into production at internal and external AT sites.
• Prepare and/or update specifications for integrated-circuit piece parts or semiconductor assemblies.
• Work with the failure analysis team to improve designs and processes.

Benefits

• Competitive pay and benefits designed to support employees and their families.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level