Substrate Technologist

Apple • San Diego, CA

11d

About The Position

At Apple, the Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external hardware components used in consumer products such as iPhone, iPad, Mac, Apple Watch, and Apple TV. The Substrate Technologist will own and drive sophisticated package selection and optimization of package structures and configurations for new-generation products. The role is responsible for Apple package substrate design, technology, manufacturing, reliability, and future roadmap, working with cross-functional teams to achieve the best package performance.

The position leads RFSIP package substrate development, technology pathfinding, and roadmap definition. It works with substrate manufacturers, foundries, and OSATs to take package substrate solutions from concept to high-volume manufacturing, while collaborating with engineering and product development teams. The role also drives industry development of sophisticated package solutions, new materials, and specifications. International travel of 5% is required.

Requirements

• Bachelor's degree required.
• Proven fundamentals in materials, chemistry, or mechanical engineering.
• In-depth knowledge of substrate technology, manufacturing processes, design rules, and roadmaps.
• Hands-on experience in substrate manufacturing and technology development, including Cu plating, lithography, dielectric materials, laser via formation, or solder resist.
• Exceptional technology development and project management skills.
• Strong communication and collaboration skills.
• Able to travel internationally 5%.

Nice To Haves

• MS or Ph.D. and relevant industry experience.
• Familiarity with package assembly and integration processes.
• Experience with Cadence Allegro platform tools and design-for-manufacturing (DFM) design reviews.

Responsibilities

• Lead RFSIP package substrate development, technology pathfinding, and roadmap definition.
• Work with the substrate manufacturing industry, foundries, and OSATs to bring package substrate solutions from concept to high-volume manufacturing.
• Collaborate directly with cross-functional groups in engineering and product development.
• Drive sophisticated package solutions, new material development, and specifications within the industry.
• Own and drive package selection and new-generation product package structure and configuration optimization.
• Be responsible for package substrate design, technology, manufacturing, reliability, and future roadmap.

What This Job Offers

• Job Type: Full-time