About The Position

The Technical Support Engineer provides technical support for customer development programs involving Mobile AiP, SiP, FC-CSP, and RF package substrates. The role resolves technical issues and drives performance stabilization at customer sites, identifies proof-of-concept opportunities through customer engagement, and guides BOM and substrate structure selection using LGIT technical solutions. The engineer leads design reviews, TRA assessments, yield improvement, and production readiness, coordinating between customer engineering and LGIT R&D, Process, Quality, and Manufacturing teams. The position also conducts customer meetings and technical presentations, gathers customer feedback and market intelligence to inform technology roadmaps, supports technology promotions and strategic customer engagements, and promotes advanced substrate technologies including Hybrid Stack-up, Fine Pattern, Cavity, and Hyper Flex. The role involves on-site customer support and frequent travel to customer sites within the U.S., as well as periodic travel to Korea for engineering and business reviews.

Requirements

  • Bachelor's degree or higher in Engineering, Materials Science, Chemistry, or a related field.
  • Bilingual proficiency in English and Korean.
  • 10+ years of experience in package substrate development, process or customer engineering, or technical marketing.
  • Proven record of leading substrate projects through mass production.
  • Deep knowledge of substrate processes, materials, structures, and design rules.
  • Hands-on experience with ABF, ETS, Hybrid Stack-up, Cavity, Fine Pattern, and RF.
  • Ability to translate customer requirements into technical solutions.
  • Experience in NPI, yield improvement, and production transfer.
  • Strong customer relationship management skills.
  • Clear technical presentation and communication skills.
  • Project management and problem-solving capability.
  • Proficiency with MS Office, including PowerPoint, Excel, and Word.

Nice To Haves

  • Experience supporting major semiconductor customers.
  • Six Sigma Green Belt or equivalent.
  • PMP or equivalent project management certification.

Responsibilities

  • Provide technical support for customer development programs involving Mobile AiP, SiP, FC-CSP, and RF.
  • Resolve technical issues and drive performance stabilization at customer sites.
  • Identify and develop proof-of-concept opportunities through customer engagement.
  • Guide BOM and substrate structure selection using LGIT technical solutions.
  • Lead design reviews, TRA assessments, yield improvement, and production readiness.
  • Coordinate between customer engineering and LGIT R&D, Process, Quality, and Manufacturing.
  • Conduct regular customer meetings and technical presentations.
  • Collect customer feedback and market intelligence to shape technology roadmaps.
  • Support technology promotions, exhibitions, and strategic customer engagements.
  • Promote advanced substrate technologies, including Hybrid Stack-up, Fine Pattern, Cavity, and Hyper Flex.
  • Provide on-site customer support and travel frequently to U.S. customer sites, with periodic travel to Korea for engineering and business reviews.
© 2026 Teal Labs, Inc
Privacy PolicyTerms of Service