Technical Support Engineer (Package Substrate) Bilingual in Korean

Cesna Recruitment•Cupertino, CA

About The Position

The Technical Support Engineer provides technical support for customer development programs involving Mobile AiP, SiP, FC-CSP, and RF. The role resolves technical issues, stabilizes performance at customer sites, identifies proof-of-concept opportunities through customer engagement, and guides BOM and substrate structure selection using LGIT technical solutions. It leads design reviews, TRA assessments, yield improvement, and production readiness, while coordinating between customer engineering and LGIT R&D, Process, Quality, and Manufacturing teams. The position also conducts regular customer meetings and technical presentations, gathers customer voice and market intelligence to shape technology roadmaps, and supports technology promotions, exhibitions, and strategic customer engagements. It promotes advanced substrate technologies, including Hybrid Stack-up, Fine Pattern, Cavity, and Hyper Flex. The role requires on-site customer support, frequent travel to customer sites within the U.S., and periodic travel to Korea for engineering and business reviews.

Requirements

Bachelor's degree or higher in Engineering, Materials Science, Chemistry, or a related field.
Bilingual proficiency in English and Korean.
10+ years of experience in package substrate development, process or customer engineering, or technical marketing.
Proven record of leading substrate projects through mass production.
Deep knowledge of substrate processes, materials, structures, and design rules.
Hands-on experience with ABF, ETS, Hybrid Stack-up, Cavity, Fine Pattern, and RF.
Ability to translate customer requirements into technical solutions.
Experience in NPI, yield improvement, and production transfer.
Strong customer relationship management skills.
Clear technical presentation and communication skills.
Project management and problem-solving capability.
Proficiency with MS Office, including PowerPoint, Excel, and Word.

Nice To Haves

Experience supporting major semiconductor customers.
Six Sigma Green Belt or equivalent.
PMP or equivalent project management certification.

Responsibilities

Provide technical support for customer development programs involving Mobile AiP, SiP, FC-CSP, and RF.
Resolve technical issues and drive performance stabilization at customer sites.
Identify and develop proof-of-concept opportunities through customer engagement.
Guide BOM and substrate structure selection using LGIT technical solutions.
Lead design reviews, TRA assessments, yield improvement, and production readiness.
Coordinate between customer engineering and LGIT R&D, Process, Quality, and Manufacturing.
Conduct regular customer meetings and technical presentations.
Collect customer voice and market intelligence to shape technology roadmaps.
Support technology promotions, exhibitions, and strategic customer engagements.
Promote advanced substrate technologies, including Hybrid Stack-up, Fine Pattern, Cavity, and Hyper Flex.
Provide on-site customer support and travel frequently to customer sites within the U.S., with periodic travel to Korea for engineering and business reviews.