Staff Engineer, Package Engineering
About The Position
The Staff Engineer, Package Engineering will lead new product introduction (NPI) package development from concept through production release and ramp. The role covers package definition, prototype delivery, validation, qualification, and production readiness for advanced semiconductor packages. The engineer will work with business units, sales, marketing, internal cross-functional teams, outsourced semiconductor assembly and test providers (OSATs), substrate and material suppliers, and procurement to determine optimal package solutions and address technical, quality, reliability, and cost considerations. The position supports advanced packaging for high-performance computing, AI, and networking products. Relevant package technologies include multi-chip and multi-component configurations, 2.5D and 3D packages, co-packaged copper or optics, and advanced substrates. The role also defines package design-for-excellence (DFx) guidelines and drives their implementation in the design stage.
Requirements
- Master’s degree or foreign equivalent in Mechanical/Manufacturing Engineering, Civil/Industrial Engineering, or a related field.
- Two years of experience in the job offered or a related occupation.
- Two years of experience in an IC packaging high-volume manufacturing cleanroom environment.
- Two years of experience implementing design rules for package manufacturability.
- Two years of experience using KLayout, Cadence APD, and AutoCAD.
- Two years of experience with process integration across wafer saw, molding, and back-end packaging operations.
- Two years of experience with simulations for mechanical warpage, thermo-mechanical stress, and interconnect reliability in advanced IC packages.
- Two years of experience with 3D mechanical modeling using SolidWorks or Autodesk Inventor for packaging-structure design.
- Two years of experience integrating CAD geometry into simulation workflows for package- and board-level stress analysis.
- Two years of experience managing packaging design rules for manufacturing related to bump pitch, back-end metal layers, and assembly tolerances.
- Applicants must be eligible to access export-controlled information as defined under applicable law; applicants may be subject to an export license review process.
Responsibilities
- Perform NPI package development, validation, qualification, and production release.
- Support business units, sales, and marketing in determining optimal package solutions.
- Work with internal cross-functional teams and lead NPI package development from concept to production.
- Manage NPI package activities, including package definition, prototype delivery, qualification, production release, and ramp.
- Define package DFx guidelines and drive their implementation during design.
- Manage and drive OSATs on technical risk assessment, design reviews, bill of materials (BOM) and process selection, package characterization, design of experiments (DOEs), and qualification.
- Lead resolution of package-related quality and reliability issues with internal cross-functional teams and external OSAT, substrate, and material supplier technical teams.
- Work with procurement and suppliers on package cost analysis.
Benefits
- Eligible to participate in Marvell’s bonus and equity plans, including a new hire equity grant and annual equity refreshers.
- Competitive compensation and benefits.
- A collaborative, transparent, and inclusive work environment.
- Tools and resources to support success, growth, and development.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
