Staff Advanced Packaging/Process Engineer of R&D

Lumentum • San Jose, CA

9d • $112,050 - $160,050

About The Position

Lumentum Operations LLC is seeking a Staff Advanced Packaging/Process Engineer for R&D to develop cutting-edge packaging solutions for optical and photonic devices. The role focuses on innovating and optimizing processes to produce high-performance, reliable, and cost-effective packaging.

The engineer will lead packaging-process design, development, and optimization for new products from concept through high-volume manufacturing. The position involves hands-on process development, characterization, troubleshooting, process control, materials and equipment evaluation, and failure analysis. The engineer will work with design, product engineering, reliability, and manufacturing teams to transfer new technologies into production, document procedures, mentor junior engineers, and provide technical leadership. The role also requires staying current with industry trends and emerging technologies.

Requirements

• Master's or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related discipline.
• At least 8 years of experience in advanced packaging or process engineering within the optoelectronics, photonics, or semiconductor industry, with a strong R&D focus.
• Demonstrated expertise in multiple packaging technologies, such as chip-on-board (COB), flip-chip, wafer-level packaging (WLP), system-in-package (SiP), hermetic sealing, and optical assembly.
• Proficiency with bonding techniques such as wire bonding, thermocompression bonding, and epoxy attach.
• Strong understanding of packaging-related materials science, including adhesives, solders, encapsulants, and substrates.
• Hands-on experience with packaging equipment, including pick-and-place, wire bonders, reflow ovens, and optical alignment systems.
• Solid knowledge of statistical process control (SPC), design of experiments (DOE), and failure analysis techniques.
• Excellent problem-solving, analytical, and communication skills.
• Ability to work independently and collaboratively in a fast-paced R&D environment.

Nice To Haves

• Experience with CAD tools for package design and simulation.

Responsibilities

• Lead the design, development, and optimization of advanced packaging processes for new optical and photonic products, from concept to high-volume manufacturing.
• Conduct hands-on process development, characterization, and troubleshooting for die attach, wire bonding, flip-chip, optical alignment, hermetic sealing, and advanced interconnection schemes.
• Develop and implement process control strategies, statistical process control (SPC), and design of experiments (DOE) to improve yield, reliability, and manufacturability.
• Collaborate with design, product engineering, reliability, and manufacturing teams to transfer new packaging technologies into production.
• Evaluate and select materials, equipment, and manufacturing techniques to enhance packaging performance, reduce cost, and improve throughput.
• Perform root cause analysis for packaging-related failures and implement corrective actions.
• Document process specifications, manufacturing instructions, and test procedures.
• Mentor junior engineers and provide technical leadership within the R&D team.
• Stay abreast of industry trends, emerging technologies, and competitive landscapes in advanced packaging.

Benefits

• Flexible time off.
• Health and wellness benefits, including physical and mental health.
• Tuition reimbursement and career growth support.
• Free gym, games room, and prayer room.
• Subsidized meals and free coffee/tea.
• Employee stock options and incentive plans.
• A collaborative, innovative, and inclusive culture.
• Competitive total compensation packages may include annual bonus, equity, and health and welfare benefits.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior