Process Integrator Advanced Packaging & Co-Packaged Optics R&D

Applied Materials•Santa Clara, CA

10d•$176,000 - $242,000•Onsite

About The Position

Applied Materials is seeking an experienced Process Integrator to lead development and integration of advanced semiconductor packaging modules in an R&D environment. The role connects unit processes, materials, device requirements, metrology, reliability, and equipment capabilities to build robust integrated flows. The integrator works across Applied Materials business units, external partners, and customers to turn complex technical objectives into executable integration plans, learning cycles, and differentiated solutions. Experience in co-packaged optics (CPO), photonics packaging, or optical/electrical heterogeneous integration is strongly preferred. The position is based on-site in Albany, New York, with close collaboration across laboratory, fab, metrology, and integration teams. Periodic domestic and international travel may be required to support customers, partners, and cross-site teams; the listed travel expectation is 10%. The role is designated E6 and calls for a recognized technical authority who can lead programs with significant technical risk and organizational complexity, define strategy, influence execution across functions, align stakeholders, and communicate with senior technical and business leaders. The position is full-time and regular. The stated salary range is $176,000 to $242,000. Relocation is eligible. The posting also notes a comprehensive benefits package and possible bonus and stock award program participation, as applicable.

Requirements

MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Applied Physics, Photonics, or a related technical field.
5–10 years of experience in a semiconductor process-integrator or process-integration role, with substantial experience in R&D or advanced technology development.
Demonstrated experience building and executing integrated semiconductor or photonics process flows involving multiple process modules and cross-functional engineering teams.
Strong understanding of CPO, silicon photonics, photonic integrated circuits, optical engines, or optical/electrical heterogeneous integration.
Working knowledge of photonic and electronic die integration, optical coupling and alignment, fiber attach interfaces, fine-pitch interconnects, and advanced substrate or interposer integration.
Understanding of optical loss, alignment tolerances, thermal management, thermal-mechanical interactions, packaging-induced stress, defect mechanisms, metrology, characterization, and reliability.
Experience planning experiments, applying statistical analysis and DOE methods, interpreting optical, electrical, physical, and reliability datasets, and converting results into clear technical decisions.
Proven ability to lead technically complex R&D projects involving ambiguity, risk, and interdependencies while maintaining execution discipline.
Self-directed, collaborative, and comfortable working in a fast-paced global R&D organization.
Excellent written and verbal communication skills, including the ability to explain complex CPO integration issues to diverse technical and executive audiences.

Nice To Haves

Direct experience with co-packaged optics (CPO), silicon photonics, photonic integrated circuits, optical engines, or optical/electrical heterogeneous integration.
Experience with advanced packaging technologies such as 2.5D/3D integration, hybrid or fusion bonding, die-to-wafer or wafer-to-wafer integration, TSVs, fine-pitch interconnects, chiplets, advanced substrates, interposers, or wafer-level packaging.
Knowledge of optical alignment, coupling, packaging tolerances, optical loss, thermal-mechanical interactions, or photonics test and characterization.
Experience interfacing with customers, research consortia, universities, suppliers, or ecosystem partners on emerging technology programs.
A record of patents, publications, invited presentations, or technical leadership in semiconductor integration, advanced packaging, or photonics.

Responsibilities

Own end-to-end process integration for advanced packaging and heterogeneous integration programs, from concept and architecture through demonstration and technology transfer.
Develop integrated process flows for photonic integrated circuits, electronic ICs, optical engines, interposers, substrates, and fiber interfaces, including module sequences, process windows, control plans, and learning-cycle strategies.
Translate optical, electrical, thermal, mechanical, reliability, and manufacturability requirements into process-integration specifications and measurable success criteria for CPO modules.
Lead cross-functional execution across photonics, device, packaging, bonding, lithography, deposition, etch, clean, CMP, plating, metrology, optical test, electrical test, failure analysis, modeling, and reliability teams.
Drive integration of photonic and electronic die, including die-to-wafer or wafer-to-wafer bonding, fine-pitch interconnects, optical coupling and alignment, fiber attach interfaces, and advanced substrate or interposer integration.
Design and execute structured experiments and DOEs to optimize optical loss, coupling efficiency, alignment tolerance, interconnect performance, thermal behavior, defectivity, yield, and reliability.
Integrate laser, modulator, detector, waveguide, electronic IC, thermal-management, and package-level requirements into stable module and full-flow performance.
Identify and resolve CPO integration risks, including contamination, bonding defects, overlay and alignment error, warpage, thermal-mechanical stress, optical-interface degradation, and process-induced device shifts.
Create CPO technology roadmaps, integration reviews, risk assessments, schedules, and executive-ready reports; communicate with engineers, senior leaders, customers, research partners, and suppliers.
Identify invention opportunities, contribute to intellectual property, and establish disciplined R&D practices for CPO integration, data quality, documentation, and technical decision-making.
Lead programs with significant technical risk and organizational complexity, define strategy, and influence execution across functions.
Align stakeholders and persuade senior technical and business leaders using data and sound engineering judgment.
Balance technical ownership with program execution, customer impact, and development of others.