Team Lead Co-Packaged Optics (m/f/d)

Q.ANT GmbH • Stuttgart, Baden-Württemberg

1h

About The Position

Q.ANT is seeking a Team Lead Co-Packaged Optics to build and lead a new CPO Packaging Team and establish technical ownership of semiconductor packaging at the intersection of photonics and electronics. The role will guide packaging development from concept through high-volume production, connecting internal chip design with external global OSAT manufacturing partners.

The team lead will develop co-packaged photonic and electronic assemblies, including optical fiber coupling and attachment, advanced packaging materials, and thermal management. The role also covers supplier evaluation and qualification, design-for-manufacturability practices, reliability qualification, product introduction, and production scale-up. The position serves as a key interface across internal engineering and manufacturing functions and external supply-chain stakeholders, while building a high-performance team and driving structured resolution of engineering and process issues.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or a closely related technical field.
• At least 5 years of experience in the semiconductor packaging industry, particularly in a Back-End or OSAT environment.
• Proven track record in global supplier evaluation.
• Hands-on experience with Co-Packaged Optics (CPO) packaging and optical fiber attachment methods.
• Experience with advanced packaging materials, including substrates, underfills, and thermal interface materials (TIMs).
• Demonstrated experience building, scaling, and coaching engineering teams.
• Solution-oriented mindset and strong process ownership in a high-growth environment with tight project milestones.
• Exceptional written and verbal communication skills.
• Fluency in English.

Nice To Haves

• Experience with glass substrates.
• Proficiency in German.

Responsibilities

• Build, mentor, and disciplinarily lead a CPO Packaging engineering team; perform gap analyses and strategic hiring to support the scaling roadmap.
• Own the evaluation, qualification, and end-to-end technical management of global OSAT partners, with the goal of onboarding at least two qualified CPO suppliers within 12 months.
• Drive development of co-packaged photonic and electronic assemblies, including optical fiber coupling and attachment, advanced packaging materials, and thermal management.
• Implement Design for Manufacturability (DFM) guidelines and ensure reliability qualification under JEDEC and Telcordia standards.
• Coordinate internal Chip Design, Systems, Manufacturing, and Test teams with external supply-chain stakeholders to support product introduction and volume production.
• Lead root-cause analysis using structured methods such as 8D, FMEA, and Ishikawa to resolve reliability or process deviations.

Benefits

• Encouragement of self-responsibility and accelerated professional development.
• Opportunity to contribute to breakthrough photonic computing technology and have a lasting impact on computing.
• Work with a passionate, international, highly skilled cross-functional team.
• Access to the company founders.

What This Job Offers

• Job Type: Full-time
• Career Level: Manager