Sr. Staff, Signal Integrity and Power Integrity Engineer
About The Position
Marvell’s Central Engineering team is seeking a high-speed IC package development engineer to contribute to advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The role covers package development, electrical design, modeling, and characterization, including signal and power integrity, while accounting for manufacturing and assembly tolerances. The engineer will work with package suppliers to select package technology, drive layout, and ensure manufacturability and compliance with performance, reliability, and cost requirements. The role also interfaces with marketing and IC designers to develop achievable package specifications and contribute to new package technology development.
Requirements
- Bachelor’s degree in Computer Science, Electrical Engineering, or a related field with 5–8 years of related professional experience, or a Master’s/PhD in those fields with 1–3 years of experience.
- Strong fundamentals in electromagnetics, transmission lines, and microwave theory.
- Experience using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, or Cadence Clarity.
- Ability to manage package development involving cross-functional teams.
- Familiarity with IC package layout tools such as APD or PADS.
- Ability to automate SI, PI, and packaging activities using scripting tools such as Python.
- Working knowledge of circuit design tools such as Spectre, ADS, or HSpice.
- Experience with VNA and TDR measurements for package and PCB characterization.
- Knowledge of frequency-domain and time-domain high-speed signaling.
- Experience with high-speed electronic packaging for digital and analog ICs.
- Experience with power-plane design, modeling, and analysis using tools such as PowerSI or SIwave.
- Familiarity with packaging technologies, materials, package substrate design rules, and assembly rules.
- Understanding, debugging, and simulation of EMI/EMC problems.
- A team player with strong communication, presentation, and documentation skills.
Nice To Haves
- Familiarity with Co-Packaged Optics and optics packaging.
- Experience with 2.5D/3D package development.
- Track record of new product introduction from concept through development and production.
- Knowledge of thermal and mechanical analysis of IC package development.
- Experience with channel simulations using MATLAB, ADS, or other tools.
Responsibilities
- Develop advanced IC packages for semiconductors supporting 448 Gb/s data rates and beyond.
- Perform package electrical design, modeling, and characterization, including signal and power integrity, while considering manufacturing and assembly tolerances.
- Interface with package suppliers to select package technology and drive package layout.
- Ensure package manufacturability and compliance with performance, reliability, and cost requirements.
- Collaborate with marketing and IC designers to develop achievable package specifications.
- Contribute to new package technology development.
- Manage package development with cross-functional teams, including assembly development, IC physical layout, analog and digital designers, and marketing.
- Automate signal integrity, power integrity, and packaging activities using scripting tools.
Benefits
- Bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
- Employee stock purchase plan with a 2-year look back.
- Family support programs.
- Mental health resources.
- Recognition and service awards.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
