Rambus is seeking a Sr. Principal Engineer with signal integrity and package design experience to join the Memory Interface Chips BU engineering team in John's Creek, Georgia. Reporting to the Senior Director of Engineering, this full-time role works within the SI/PI team on modeling, analysis, and simulations of signal integrity (SI) and power integrity (PI) for DDR products operating at speeds up to 16000+ MT/s. The role follows a hybrid approach: employees are encouraged to work onsite an average of at least three days per week, with up to two days of remote work. The engineer will provide technical leadership in SI/PI and package design, develop methodologies, and collaborate with design, validation, and customer teams. The work includes system and package requirements, simulations, silicon correlation, and support for lab debug and bring-up. The position requires an advanced electrical engineering degree, substantial industry experience, and expertise in high-speed memory interfaces, signal-integrity analysis, and related simulation tools. Rambus is a global provider of memory interface chips and silicon IP. The company offers competitive compensation, including base salary, bonus, equity, matching 401(k), employee stock purchase plan, medical and dental benefits, a time-off program, and gym membership. The US salary range for this full-time position is $126,100 to $234,100; starting pay depends on job-related skills, experience, qualifications, work location, and market conditions. Rambus states its commitment to an inclusive workplace and equal employment opportunity.
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Job Type
Full-time
Career Level
Senior