Sr. Module Engineer, Hybrid Bonding
About The Position
We are seeking a highly motivated Die-to-Wafer Hybrid Bonding Module Engineer to develop and scale next-generation hybrid bonding technologies for advanced semiconductor packaging applications including Memory, chiplets, AI accelerators, photonics, and heterogeneous integration platforms. The successful candidate will lead process module development across die preparation, surface activation, die placement, hybrid bonding, post-bond characterization, yield improvement, and manufacturing scale-up. This role requires close collaboration with equipment development teams, process integration engineers, materials scientists, device architects, and external ecosystem partners. The position is ideal for candidates passionate about enabling future high-bandwidth and energy-efficient computing systems through advanced interconnect technologies. Hybrid bonding technologies including copper-copper and dielectric-dielectric direct bonding are critical enablers for next-generation 3D integration and HBM stacking.
Requirements
- M.S. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or Semiconductor Manufacturing OR Ph.D. in one of the above disciplines.
- Minimum 5+ years of semiconductor process development experience after graduate degree.
- Direct experience in at least one of the following: Hybrid bonding, Thermocompression bonding, Wafer bonding, Advanced packaging, HBM development, Cu interconnect technology, Chiplet integration.
- Strong understanding of: Cu-Cu interconnect formation, Surface chemistry and plasma activation, CMP and planarization, Defect engineering, Semiconductor process integration, Statistical process analysis.
- Experience with DOE and JMP/Minitab analysis tools.
- Familiarity with metrology and failure analysis techniques.
Nice To Haves
- Ph.D. with 5+ years industry experience.
- Experience in HBM or 3D stacking technologies.
- Experience with: Hybrid bonding equipment development, Direct bonding interconnect (DBI), Die placement systems, Advanced packaging process integration.
- Knowledge of AI/HPC packaging architectures.
- Experience working with 200 mm and 300 mm wafer manufacturing environments.
- Track record of patents, publications, or conference presentations (ECTC, IEEE, IMAPS, SEMI, etc.).
- Strong technical leadership.
- Excellent problem-solving skills.
- Hands-on laboratory mindset.
- Ability to drive technology from R&D into manufacturing.
- Effective communicator across engineering, operations, and customer-facing teams.
- Passion for enabling next-generation AI and high-performance computing platforms.
Responsibilities
- Develop and optimize die-to-wafer (D2W) hybrid bonding processes for advanced packaging applications.
- Establish process windows for: Surface preparation, Plasma activation, Die placement, Alignment and overlay control, Bonding temperature and pressure optimization, Post-bond annealing.
- Drive Cu-Cu and dielectric-dielectric interconnect formation with focus on electrical performance and reliability.
- Support integration of hybrid bonding into: Memory architectures, Chiplet-based systems, Silicon interposers, System-on-Wafer platforms, Co-packaged optics (CPO).
- Collaborate with integration teams to resolve process interactions and yield excursions.
- Identify root causes of: Bond voids, Die shift, Overlay errors, Non-uniform bonding, Particle contamination.
- Utilize DOE methodologies and statistical process control to improve yield and process robustness.
- Drive bonding quality characterization using: CSAM, X-ray inspection, FIB/SEM, AFM, Optical metrology, Electrical test structures.
- Develop correlation between process parameters and package performance.
- Work closely with equipment engineering teams on: Hybrid bonding systems, Die placement tools, Plasma activation modules, Surface preparation modules, Integrated process control solutions.
- Participate in evaluation and qualification of next-generation bonding platforms.
- Define and execute reliability test plans: Thermal cycling, HTOL, Mechanical pull/shear testing, Moisture sensitivity evaluations.
- Drive failure analysis and corrective actions.
- Lead cross-functional projects from concept through technology transfer.
- Publish technical results internally and externally.
- Present development progress to engineering leadership and customers.
- Mentor junior engineers and researchers.
Benefits
- Comprehensive benefits package
- Participation in a bonus program
- Stock award program
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What This Job Offers
Job Type
Full-time
Career Level
Senior
