The Wireless Module Engineer is a self-driven technical lead responsible for developing wireless modules from early architecture definition through mass-production ramp. The role spans RF design, packaging, product engineering and yield analysis, automated test equipment (ATE), and reliability engineering. It supports multiple product lines within the Hardware Technology organization and requires close collaboration across internal engineering teams and outsourced semiconductor assembly and test (OSAT) partners. The engineer leads early RF architecture and specification discussions with internal teams and OSATs, ensures compliance with internal specifications and approval workflows, and drives formal module design releases. This includes reviewing schematics, PCB layouts, electromagnetic and RF simulation results, design-for-manufacturability, test readiness, and OSAT feedback. The engineer manages module integration and ATE test coverage at OSATs, including the maturity of test hardware and software, firmware, module calibration, GRR, and CPK/data analysis. They validate and approve ATE integration, test coverage, and test limits so tested modules are delivered on time for product NPI builds. After NPI builds, the engineer leads failure analysis with OSATs and drives improvements to testers, test time, yield, and retest rates. The role also involves international travel to OSATs for one to two weeks before NPI builds to bring up modules and ATE and troubleshoot issues, including I2C and PCIe interface problems. The engineer works with reliability teams to turn expected product field-use profiles into practical, data-driven reliability test models, communicates component risks and mitigation plans, and helps take RF modules to mass production at yields meeting Apple quality requirements.
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Job Type
Full-time