Wireless Module Engineer

Apple•San Diego, CA

About The Position

The Wireless Module Engineer (WME) is a self-driven technical lead responsible for developing wireless modules from early architecture definition through mass-production ramp. The role collaborates across RF design, reliability, manufacturing test, supply chain, and system integration, and supports multiple product lines within Apple’s Hardware Technology organization. The WME leads early RF architecture and specification discussions with internal engineering teams and outsourced semiconductor assembly and test (OSAT) partners, ensures OSAT compliance with internal specification and approval processes, and drives formal module design release checkpoints. These checkpoints cover schematics, PCB layout, electromagnetic and RF simulation results, design for manufacturability, test-data readiness, and OSAT design feedback. The role manages module integration and OSAT ATE test coverage and maturity, including test hardware such as load boards, daughter cards, sockets, and handlers, as well as software, firmware, module calibrations, GRR, and CPK/data analysis. The WME coordinates validation and approval of ATE hardware and software integration, test coverage, and test limits to support timely delivery of tested modules for product NPI builds. After NPI builds, the WME leads failure analysis with OSATs and drives improvements to ATE testers, software and firmware test time, yield, and retest rates. The role includes international travel to OSATs for one to two weeks before product NPI builds to support module and ATE bring-up and debug issues, including I2C- and PCIe-related issues. The WME also works with internal reliability engineering teams to translate product field-usage profiles into feasible, data-driven reliability test models for modules and components.

Requirements

Bachelor’s degree.
Strong RF fundamentals.
Proven written and verbal communication skills.
Ability to lead projects with self-motivation.
Ability to travel internationally.

Nice To Haves

Two or more years of wireless module development experience from early concept to mass production for consumer electronic devices.
Strong RF design background.
Experience in packaging, product engineering, ATE, and reliability engineering.
Strong data analysis skills, including yield analysis (Cpk) and retest-rate analysis for data-sheet closures.
Ability to work at both high-level theory and detailed hands-on execution.
Experience managing vendor teams and leading cross-time-zone meetings.
AI/ML experience with expertise in data analysis.
Strong verbal and written communication skills, including the ability to drive meetings toward key decisions on wireless technologies.
Ability to define engineering methods for custom wireless module and component development during prototyping.
Experience setting up project schedules and work breakdown structures and communicating risks with prioritization.
Proficiency reviewing mechanical/electrical designs for sockets, fixtures, and test systems.

Responsibilities

Lead wireless module development from early architecture definition through mass-production ramp.
Initiate and lead early-phase RF architecture and specification discussions with internal engineering teams and OSAT partners.
Ensure OSATs comply with internal specification formats, review procedures, and approval workflows.
Drive module design release checkpoints for schematics, PCB layout, electromagnetic/RF simulation results, DFM, test-data readiness, and OSAT design feedback.
Manage module integration and ATE test coverage at OSATs.
Oversee ATE maturity preparation for hardware, software, firmware, module calibrations, GRR, and CPK/data analysis.
Drive OSAT validation and approval of ATE hardware and software integration, test coverage, and test limits to support NPI builds.
Lead post-NPI failure analysis with OSATs and implement improvements to ATE testers, software/firmware test time, yield, and retest rates.
Travel internationally to OSATs for module and ATE bring-up before product NPI builds and debug bring-up issues, including I2C- and PCIe-related issues.
Facilitate collaboration with Apple multifunctional groups and define module test coverage.
Collaborate with internal reliability engineering teams to develop feasible, data-driven reliability test models from product field-usage profiles.
Communicate risks and priorities and support disciplined execution from early concept through manufacturing ramp.